SCHEMBL3731476

SCHEMBL3731476

CCCCc1c2ccccc2nc2ccccc12

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.78
ALDH1A1 P00352 2/20 0.78
GAA P10253 1/20 0.78
HPGD P15428 1/20 0.78
CYP1A2 P05177 1/20 0.60
CYP3A4 P08684 1/20 0.60
TSHR P16473 1/20 0.60
HSD17B10 Q99714 1/20 0.60
TLR8 Q9NR97 11/20 0.58
PARP1 P09874 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.50
POLB P06746 1/20 0.50
HTT P42858 1/20 0.50
RXFP1 Q9HBX9 1/20 0.50
BCHE P06276 1/20 0.49
ACHE P22303 1/20 0.49
TLR7 Q9NYK1 2/20 0.48
PDE4A P27815 1/20 0.48
PDE4B Q07343 1/20 0.48
PDE4C Q08493 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5318703 0.94 KDM4E (0.75) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL9433976 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL21633651 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL5325559 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL5319761 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL5318249 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL5318248 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL9434493 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL2537670 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2
SCHEMBL5321847 0.92 KDM4E (0.72) KDM4EALDH1A1GAAHPGDCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106233205-B Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package 日立化成株式会社 2020-06-23 CN claimed
CN-101290471-B Photoresist combination and laminating body ASAHI KASEI EMD CORP 2011-07-06 CN claimed
CN-101290471-A Photoresist combination and laminating body ASAHI KASEI EMD CORP (JP) 2008-10-22 CN claimed
US-6156870-A Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-12-05 US claimed
EP-4388020-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN Resonac Corporation (JP) 2024-06-26 EP disclosed
CN-118131567-A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board 株式会社力森诺科 2024-06-04 CN disclosed
CN-118043365-A Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern 株式会社力森诺科 2024-05-14 CN disclosed
CN-113412289-B Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board 株式会社力森诺科 2024-04-05 CN disclosed
CN-117099044-A Photosensitive resin film, method for forming resist pattern, and method for forming wiring pattern 株式会社力森诺科 2023-11-21 CN disclosed
CN-117083568-A Photosensitive element and method for manufacturing photosensitive element 株式会社力森诺科 2023-11-17 CN disclosed
CN-111315828-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-09-29 CN disclosed
CN-112154167-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-08-22 CN disclosed
CN-101194191-A Process for producing color filter, color filter, liquid crystal display element, and liquid crystal display device FUJI FILM CORP (JP) 2008-06-04 CN disclosed
CN-101101444-A Light-sensitive resin composition, light-sensitive transfer printing material, separating wall and manufacturing method thereof, color filter and manufacturing method thereof, and displaying device FUJIFILM CORP (JP) 2008-01-09 CN disclosed
WO-2007089040-A1 LIQUID CRYSTAL DISPLAY DEVICE AND COLOR FILM PLATE, AND PROCESSES FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2007-08-09 WO disclosed
CN-1721991-A Production method for photosensitive resin composition and element and related members HITACHI CHEMICAL CO LTD (JP) 2006-01-18 CN disclosed
CN-1228688-C Photosensitive resin composition, photosensitive element, method for producing protective layer pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2005-11-23 CN disclosed
CN-1432141-A Photosensitive resin composition, photosensitive element, method for producing protective layer pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2003-07-23 CN disclosed
US-6156870-A Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-12-05 US disclosed
US-5334484-A Using an acridine compound as photoinitiator HITACHI CHEMICAL CO., LTD. (JP) 1994-08-02 US disclosed