Butyl Alcohol

Butyl Alcohol

SCHEMBL3740819

CCCCO.OCCO

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 153 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122070479-A Ultrasonic indicating device and method for monitoring ultrasonic treatment JP实验室股份有限公司 2026-05-19 CN claimed
CN-110165214-A Lithium battery electrolytes flame-retarding new material 苏州贺康新材料科技有限公司 2019-08-23 CN claimed
CN-110036056-A Quaternary cation polymer 埃科莱布美国股份有限公司 2019-07-19 CN claimed
CN-109942519-A A method of 5- alkoxymethylfurfural is prepared using glucide 南开大学 2019-06-28 CN claimed
CN-108305703-A A kind of preparation and its application of medium temperature graphene/nickel composite conducting slurry 林荣铨 2018-07-20 CN claimed
CN-108305702-A A kind of preparation and its application of medium temperature graphene/silver composite conducting slurry 林荣铨 2018-07-20 CN claimed
CN-108231241-A The preparation and its application of a kind of medium temperature graphene/copper composite conducting slurry 林荣铨 2018-06-29 CN claimed
CN-107931891-A A kind of tin cream scaling powder 潮州三环(集团)股份有限公司 2018-04-20 CN claimed
CN-107750267-A Ink comprising silver nanoparticles 基因油墨股份有限公司 2018-03-02 CN claimed
CN-107378204-A A kind of anti-oxidant scaling powder of mixed gas arc welding 安徽红桥金属制造有限公司 2017-11-24 CN claimed
CN-101733589-B Halogen-free cleaning-free soldering flux for lead-free solder ZHEJIANG YIYUAN ELECTRONIC TECHNOLOGY LTD 2012-05-02 CN claimed
CN-101642855-B Rear-earth-containing halogen free Sn-Ag-C series tinol ZHEJIANG YIYUAN ELECTRONIC MATERIAL RESEARCH INSTITUTE (CN) 2012-02-22 CN claimed
CN-101733589-A Halogen-free and cleaning-free soldering flux for lead-free solder ZHEJIANG YIYUAN ELECTRONIC TEC 2010-06-16 CN claimed
CN-101653876-A Low-silver halogen free soldering paste ZHEJIANG YIYUAN ELECTRONIC MAT 2010-02-24 CN claimed
CN-101642855-A Rear-earth-containing halogen free Sn-Ag-C series tinol ZHEJIANG YIYUAN ELECTRONIC MAT 2010-02-10 CN claimed
CN-100425385-C Leadless solder paste and its preparation method DARBOND TECHNOLOGY CO LTD (CN) 2008-10-15 CN claimed
EP-0829502-B1 Photosensitive reworkable encapsulant IBM (US) 2008-03-12 EP claimed
CN-1951621-A Leadless solder paste and its preparation method DARBOND TECHNOLOGY CO LTD YANT (CN) 2007-04-25 CN claimed
CN-1324900-A Coating composition containing metal flake powder and having improved charm DU PONT (US) 2001-12-05 CN claimed
EP-0829502-A2 Photosensitive reworkable encapsulant INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1998-03-18 EP claimed