Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 9/20 | 0.58 |
| ▸ | HPGD | P15428 | 1/20 | 0.58 |
| ▸ | ATM | Q13315 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | HCAR2 | Q8TDS4 | 3/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | RAB9A | P51151 | 1/20 | 0.37 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 2/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 2/20 | 0.35 |
| ▸ | APP | P05067 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acrylonitrile SCHEMBL5834215 | 0.97 | TSHR (0.55) | TSHRHPGDATMALDH1A1CYP3A4 | |
| SCHEMBL11290324 | 0.95 | TSHR (0.52) | TSHRHPGDATMALDH1A1CYP3A4 | |
| Acrylic Acid Ethyl Ester SCHEMBL13685085 | 0.95 | TSHR (0.54) | TSHRHPGDATMALDH1A1CYP3A4 | |
| SCHEMBL11701988 | 0.90 | TSHR (0.55) | TSHRHPGDATMALDH1A1CYP3A4 | |
| SCHEMBL2259513 | 0.87 | ATM (0.50) | TSHRHPGDATMALDH1A1HCAR2 | |
| Acrylic Acid Methyl Ester SCHEMBL10836090 | 0.87 | TSHR (0.50) | TSHRHPGDATMALDH1A1CYP3A4 | |
| Acrylic Acid SCHEMBL17387529 | 0.86 | TSHR (0.49) | TSHRHPGDATMALDH1A1CYP3A4 | |
| Butadiene SCHEMBL9419686 | 0.86 | TSHR (0.47) | TSHRHPGDATMALDH1A1CYP3A4 | |
| SCHEMBL2260103 | 0.84 | ALDH1A1 (0.53) | TSHRHPGDALDH1A1HCAR2MAPT | |
| SCHEMBL13276141 | 0.84 | TSHR (0.41) | TSHRHPGDATMALDH1A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3228214-B1 | HONEYCOMB-STRUCTURED SITTING CUSHION | BULLSONE CO LTD (KR) | 2022-10-12 | — | — | EP | disclosed |
| CN-107105891-B | Honeycomb structure seat cushion | 韩商一牛有限公司 | 2020-05-29 | — | — | CN | disclosed |
| US-20190071528-A1 | ALKOXYSILANE-FUNCTIONALIZED POLYACRYLATE COMPOSITIONS AND METHODS OF PREPARATION THEREOF | HENKEL CORPORATION | 2019-03-07 | — | — | US | disclosed |
| US-10206512-B2 | Honeycomb-structured sitting cushion | BULLSONE CO., LTD. (KR) | 2019-02-19 | — | — | US | disclosed |
| US-20170347801-A1 | HONEYCOMB-STRUCTURED SITTING CUSHION | BULLSONE CO., LTD. (KR) | 2017-12-07 | — | — | US | disclosed |
| EP-3228214-A1 | HONEYCOMB-STRUCTURED SITTING CUSHION | Bullsone Co., Ltd. (KR) | 2017-10-11 | — | — | EP | disclosed |
| EP-3033361-A1 | ALKOXYSILANE-FUNCTIONALIZED POLYACRYLATE COMPOSITIONS AND METHODS OF PREPARATION THEREOF | Henkel IP & Holding GmbH (DE) | 2016-06-22 | — | — | EP | disclosed |
| US-9368421-B2 | Under-fill material and method for producing semiconductor device | NITTO DENKO CORPORATION (JP) | 2016-06-14 | — | — | US | disclosed |
| US-20160152752-A1 | ALKOXYSILANE-FUNCTIONALIZED POLYACRYLATE COMPOSITIONS AND METHOD OF PREPARATION THEREOF | HENKEL CORPORATION | 2016-06-02 | — | — | US | disclosed |
| US-20150270188-A1 | Under-Fill Material and Method for Producing Semiconductor Device | NITTO DENKO CORPORATION (JP) | 2015-09-24 | — | — | US | disclosed |
| WO-2015023372-A1 | ALKOXYSILANE-FUNCTIONALIZED POLYACRYLATE COMPOSITIONS AND METHODS OF PREPARATION THEREOF | Henkel US IP LLC (US) | 2015-02-19 | — | — | WO | disclosed |
| EP-2519088-A1 | CONDUCTIVE CONNECTION MATERIAL, ELECTRONIC COMPONENT PRODUCING METHOD, AND ELECTRONIC MEMBER AND ELECTRONIC COMPONENT WITH CONDUCTIVE CONNECTION MATERIAL | Sumitomo Bakelite Co., Ltd. (JP) | 2012-10-31 | — | — | EP | disclosed |
| US-20120261174-A1 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-10-18 | — | — | US | disclosed |
| CN-101432876-B | Semiconductor device and semiconductor device manufacturing method | SUMITOMO BAKELITE CO | 2011-08-17 | — | — | CN | disclosed |
| US-7829992-B2 | Semiconductor device and method for manufacturing semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-11-09 | — | — | US | disclosed |
| US-20090243065-A1 | Semiconductor Device and Method for Manufacturing Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-10-01 | — | — | US | disclosed |
| CN-101432876-A | Semiconductor device and semiconductor device manufacturing method | SUMITOMO BAKELITE CO (JP) | 2009-05-13 | — | — | CN | disclosed |
| EP-2012358-A1 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-01-07 | — | — | EP | disclosed |