SCHEMBL3746847

SCHEMBL3746847

CCOC(C)=C(O[SiH3])OCC

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
LMNA P02545 1/20 0.38
HSD17B10 Q99714 1/20 0.38
ALOX15 P16050 1/20 0.31
MGAM O43451 1/20 0.31
GAA P10253 1/20 0.31
SI P14410 1/20 0.31
MGAM2 Q2M2H8 1/20 0.31
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA9 Q16790 1/20 0.31
SOAT1 P35610 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5859073 0.83 ALDH1A1 (0.45) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL12311361 0.73 ALDH1A1 (0.53) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL1476126 0.72 ALDH1A1 (0.42) ALDH1A1LMNAHSD17B10GAA
SCHEMBL10489193 0.72 ALDH1A1 (0.32) ALDH1A1LMNAHSD17B10
SCHEMBL333268 0.69 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL656787 0.69 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL264826 0.69
SCHEMBL3782478 0.67 ALDH1A1 (0.47) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL8015076 0.67
SCHEMBL1060365 0.67 ALDH1A1 (0.41) ALDH1A1LMNAHSD17B10ALOX15MGAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12473474-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-11-18 US disclosed
US-11952516-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-04-09 US disclosed
US-20230047848-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-16 US disclosed
EP-4073193-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-10-19 EP disclosed
CN-115066475-A Addition curable silicone adhesive composition 迈图高新材料公司 2022-09-16 CN disclosed
US-20220119690-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2022-04-21 US disclosed
EP-3914638-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2021-12-01 EP disclosed
CN-113518794-A Addition-curable silicone adhesive composition 迈图高新材料公司 2021-10-19 CN disclosed
WO-2021118582-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2021-06-17 WO disclosed
WO-2020153947-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-07-30 WO disclosed
US-7838311-B2 Process for producing light-emitting semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2010-11-23 US disclosed
US-20090176323-A1 PROCESS FOR PRODUCING LIGHT-EMITTING SEMICONDUCTOR DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2009-07-09 US disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
US-6191220-B1 REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER DOW CORNING ASIA, LTD. (JP) 2001-02-20 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed
US-5994573-A Method for making triarylamine compounds having hydrocarbonoxysilyl groups DOW CORNING ASIA, LTD. (JP) 1999-11-30 US disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed