SCHEMBL3752269

SCHEMBL3752269

CCCCCCCCCCCC(=O)N1CCCCCCCCCC1

nearest known ligand 0.96

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
▸ L3MBTL1 Q9Y468 2/20 0.96
▸ MEN1 O00255 2/20 0.96
▸ KMT2A Q03164 2/20 0.96
▸ TDP1 Q9NUW8 1/20 0.96
▸ GNAI3 P08754 8/20 0.66
▸ GNAI1 P63096 8/20 0.66
▸ ATM Q13315 1/20 0.65
▸ GNAO1 P09471 7/20 0.62
▸ POLB P06746 1/20 0.53
▸ MAPT P10636 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6648331 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL10535945 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
N-(Decanoyl)Hexamethyleneimine SCHEMBL5693872 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL5429229 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL3984611 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL472844 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL24073266 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL14879630 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL1407232 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3
SCHEMBL5435751 1.00 L3MBTL1 (0.96) L3MBTL1MEN1KMT2ATDP1GNAI3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2029358-B1 SEMIAROMATIC POLYAMIDE COMPOSITE ARTICLE AND PROCESSES FOR ITS PREPARATION DU PONT (US) 2018-11-07 — — EP claimed
CN-110709472-B Polyamide resin composition and release film using same UBE株式会社 2022-09-27 — — CN disclosed
CN-108350270-B Polyamide resin composition and film 宇部兴产株式会社 2021-05-11 — — CN disclosed
EP-3284787-B1 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF TORAY INDUSTRIES (JP) 2020-07-29 — — EP disclosed
CN-110709472-A Polyamide resin composition and release film using same 宇部兴产株式会社 2020-01-17 — — CN disclosed
EP-2896656-B1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE TORAY INDUSTRIES (JP) 2019-05-08 — — EP disclosed
US-10119024-B2 Resin composition and molded article thereof TORAY INDUSTRIES, INC. (JP) 2018-11-06 — — US disclosed
EP-3059283-B1 POLYAMIDE RESIN COMPOSITION, MANUFACTURING METHOD, AND MOLDED ARTICLE TORAY INDUSTRIES (JP) 2018-10-10 — — EP disclosed
EP-3284787-A1 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF Toray Industries, Inc. (JP) 2018-02-21 — — EP disclosed
US-9873793-B2 Polyamide resin composition, method of manufacturing and molded product TORAY INDUSTRIES, INC. (JP) 2018-01-23 — — US disclosed
US-9493611-B2 Polyamide resin composition and molded product TORAY INDUSTRIES, INC. (JP) 2016-11-15 — — US disclosed
US-20160264778-A1 POLYAMIDE RESIN COMPOSITION, METHOD OF MANUFACTURING AND MOLDED PRODUCT TORAY INDUSTRIES, INC. (JP) 2016-09-15 — — US disclosed
EP-3059283-A1 POLYAMIDE RESIN COMPOSITION, MANUFACTURING METHOD, AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2016-08-24 — — EP disclosed
US-20150232617-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT TORAY INDUSTRIES, INC. (JP) 2015-08-20 — — US disclosed
EP-2896656-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2015-07-22 — — EP disclosed
EP-2726551-A1 IMPROVED FLOW IN REINFORCED POLYIMIDE COMPOSITIONS SABIC Innovative Plastics IP B.V. (NL) 2014-05-07 — — EP disclosed
WO-2010117706-A1 ENVIRONMENTALLY FRIENDLY ELECTRONIC DEVICE HOUSINGS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-10-14 — — WO disclosed
US-20100249282-A1 ENVIRONMENTALLY FRIENDLY ELECTRONIC DEVICE HOUSINGS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2010-09-30 — — US disclosed
CN-1134509-C Thermoplastic composition based on polyamide ͨ�õ�����˾ 2004-01-14 — — CN disclosed
CN-1276395-A Thermoplastic composition based on polyamide ATOCHEM ELF SA (FR) 2000-12-13 — — CN disclosed
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