SCHEMBL3757537

SCHEMBL3757537

O=CC1CCCO1.[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4356648 0.97
SCHEMBL28116028 0.97 LMNA (0.31)
SCHEMBL873523 0.97
SCHEMBL21145 0.97
Water SCHEMBL6323742 0.95
SCHEMBL2592648 0.95
SCHEMBL16345221 0.95
SCHEMBL28633956 0.95 HPGD (0.32)
Hydrochloric Acid SCHEMBL18690254 0.95
SCHEMBL6669492 0.95

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240019782-A1 Composition For Forming Metal Oxide Film, Patterning Process, And Method For Forming Metal Oxide Film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-18 US disclosed
EP-4303657-A2 COMPOSITION FOR FORMING METAL OXIDE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING METAL OXIDE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-10 EP disclosed
CN-110515266-B Pattern forming method 信越化学工业株式会社 2023-06-23 CN disclosed
CN-110515272-B Pattern forming method 信越化学工业株式会社 2023-06-23 CN disclosed
US-11614686-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-03-28 US disclosed
US-11366386-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-06-21 US disclosed
US-11231649-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-01-25 US disclosed
EP-3572880-B1 PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2021-05-12 EP disclosed
EP-3572878-B1 PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2020-12-30 EP disclosed
CN-110515272-A Pattern forming method SHINETSU CHEMICAL CO 2019-11-29 CN disclosed
US-20190258160-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-08-22 US disclosed
US-9748097-B2 Coating liquid for forming metal oxide film, metal oxide film, field-effect transistor, and method for producing field-effect transistor RICOH COMPANY, LTD. (JP) 2017-08-29 US disclosed
US-20160042947-A1 COATING LIQUID FOR FORMING METAL OXIDE FILM, METAL OXIDE FILM, FIELD-EFFECT TRANSISTOR, AND METHOD FOR PRODUCING FIELD-EFFECT TRANSISTOR RICOH COMPANY, LTD. (JP) 2016-02-11 US disclosed
EP-2962327-A1 COATING LIQUID FOR FORMING METAL OXIDE FILM, METAL OXIDE FILM, FIELD-EFFECT TRANSISTOR, AND METHOD FOR PRODUCING FIELD-EFFECT TRANSISTOR Ricoh Company, Ltd. (JP) 2016-01-06 EP disclosed
WO-2014157733-A1 COATING LIQUID FOR FORMING METAL OXIDE FILM, METAL OXIDE FILM, FIELD-EFFECT TRANSISTOR, AND METHOD FOR PRODUCING FIELD-EFFECT TRANSISTOR RICOH COMPANY, LTD. (JP) 2014-10-02 WO disclosed
US-7837976-B2 Activated aluminum hydride hydrogen storage compositions and uses thereof BROOKHAVEN SCIENCE ASSOCIATES, LLC (US) 2010-11-23 US disclosed
EP-1798599-B1 Antireflection film composition, patterning process and substrate using the same SHINETSU CHEMICAL CO (JP) 2008-08-06 EP disclosed
EP-1798599-A1 Antireflection film composition, patterning process and substrate using the same Shinetsu Chemical Co., Ltd. (JP) 2007-06-20 EP disclosed
US-20070134916-A1 Antireflection film composition, patterning process and substrate using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-06-14 US disclosed
US-20070025908-A1 Activated aluminum hydride hydrogen storage compositions and uses thereof ENERGY, UNITED STATES DEPARTMENT OF 2007-02-01 US disclosed