⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL730417 | 0.95 | — | — | |
| SCHEMBL5078287 | 0.93 | LMNA (0.31) | — | |
| SCHEMBL200512 | 0.87 | — | — | |
| SCHEMBL374927 | 0.86 | LMNA (0.34) | — | |
| SCHEMBL28074099 | 0.85 | LMNA (0.35) | — | |
| SCHEMBL17512237 | 0.85 | LMNA (0.35) | — | |
| SCHEMBL11473989 | 0.85 | LMNA (0.35) | — | |
| SCHEMBL28309136 | 0.84 | — | — | |
| SCHEMBL729780 | 0.84 | LMNA (0.33) | — | |
| SCHEMBL6064038 | 0.84 | LMNA (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2393861-B1 | MOISTURE-CURABLE SILYLATED POLYMER POSSESSING IMPROVED STORAGE STABILITY | MOMENTIVE PERFORMANCE MAT INC (US) | 2013-10-23 | — | — | EP | claimed |
| US-8138297-B2 | Moisture-curable silylated polymer possessing improved storage stability | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2012-03-20 | — | — | US | claimed |
| US-20100204384-A1 | Moisture-curable silylated polymer possessing improved storage stability | MOMENTIVE PERFORMANCE MATERIALS INC. | 2010-08-12 | — | — | US | claimed |
| US-7518009-B2 | Process for preparing mercaptoorganyl (alkoxysilanes) | EVONIK DEGUSSA GMBH (DE) | 2009-04-14 | — | — | US | claimed |
| US-20060252952-A1 | Process for preparing mercaptoorganyl (alkoxysilanes) | DEGUSSA AG (DE) | 2006-11-09 | — | — | US | claimed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12139635-B2 | Coatings for waterproofing electronic components | HENKEL AG & CO. KGAA (DE) | 2024-11-12 | — | — | US | disclosed |
| EP-1634884-A1 | Process for preparing mercaptoorganyl alkoxy silanes | Degussa GmbH (DE) | 2006-03-15 | — | — | EP | disclosed |
| US-20060052622-A1 | Process for the preparation of mercaptoorganyl (alkoxysilanes) | EVONIK DEGUSSA GMBH (DE) | 2006-03-09 | — | — | US | disclosed |
| US-20060052621-A1 | Process for producing mercaptoorganyl (alkoxysilane) | EVONIK DEGUSSA GMBH (DE) | 2006-03-09 | — | — | US | disclosed |
| US-6995280-B2 | Process for preparing (mercaptoorganyl)alkoxysilanes | DEGUSSA AG (DE) | 2006-02-07 | — | — | US | disclosed |
| US-20050124822-A1 | Process for the preparation of (mercaptoorganyl)alkoxysilanes | EVONIK OPERATIONS GMBH (DE) | 2005-06-09 | — | — | US | disclosed |
| US-20050124821-A1 | Process for preparing (mercaptoorganyl)alkoxysilanes | EVONIK OPERATIONS GMBH (DE) | 2005-06-09 | — | — | US | disclosed |
| EP-1538152-A1 | Process for the preparation of (mercaptoorganyl)-alkoxysilanen | Degussa AG (DE) | 2005-06-08 | — | — | EP | disclosed |
| EP-1529782-A1 | Process for preparing mercaptoorganyl alkoxy silanes | Degussa AG (DE) | 2005-05-11 | — | — | EP | disclosed |