Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 8/20 | 0.49 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.49 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.49 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 3/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.41 |
| ▸ | ACMSD | Q8TDX5 | 1/20 | 0.41 |
| ▸ | CA12 | O43570 | 1/20 | 0.41 |
| ▸ | CA1 | P00915 | 1/20 | 0.41 |
| ▸ | CA2 | P00918 | 1/20 | 0.41 |
| ▸ | CA7 | P43166 | 1/20 | 0.41 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.41 |
| ▸ | PDK4 | Q16654 | 1/20 | 0.41 |
| ▸ | CA9 | Q16790 | 1/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | NPC1 | O15118 | 2/20 | 0.39 |
| ▸ | RAB9A | P51151 | 2/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16163918 | 0.84 | KDM4E (0.42) | KDM4EL3MBTL1MAPK1NPSR1TSHR | |
| SCHEMBL20773666 | 0.82 | NPC1 (0.42) | KDM4EL3MBTL1NPSR1TSHRTDP1 | |
| SCHEMBL31003881 | 0.81 | TDP1 (0.53) | KDM4EL3MBTL1MAPK1TSHRTDP1 | |
| SCHEMBL22660201 | 0.81 | TDP1 (0.53) | KDM4EL3MBTL1MAPK1TSHRTDP1 | |
| SCHEMBL30521020 | 0.81 | KDM4E (0.50) | KDM4EL3MBTL1NPSR1TSHRTDP1 | |
| SCHEMBL2585576 | 0.81 | KDM4E (0.50) | KDM4EL3MBTL1NPSR1TSHRTDP1 | |
| SCHEMBL8137479 | 0.79 | KDM4E (0.46) | KDM4EL3MBTL1MAPK1TSHRTDP1 | |
| Hydrochloric Acid SCHEMBL11152148 | 0.79 | KDM4E (0.48) | KDM4EL3MBTL1NPSR1TSHRTDP1 | |
| SCHEMBL28569322 | 0.79 | KDM4E (0.53) | KDM4EL3MBTL1MAPK1NPSR1TSHR | |
| SCHEMBL31432467 | 0.77 | KDM4E (0.47) | KDM4EL3MBTL1MAPK1NPSR1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7843045-B2 | Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 2010-11-30 | — | — | US | disclosed |
| US-7560307-B2 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-07-14 | — | — | US | disclosed |
| US-20090091012-A1 | THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, LEAD FRAME, AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-04-09 | — | — | US | disclosed |
| CN-100467539-C | Electroconductive resin composition and electronic parts using the same | HITACHI CHEMICAL CO LTD (JP) | 2009-03-11 | — | — | CN | disclosed |
| CN-100460467-C | Conductive resin composition and electronic component using same | HITACHI CHEMICAL CO LTD (JP) | 2009-02-11 | — | — | CN | disclosed |
| CN-1325558-C | Paste composition, and protective film and semiconductor device both obtained with the same | HITACHI CHEMICAL CO LTD (JP) | 2007-07-11 | — | — | CN | disclosed |
| CN-1876717-A | Electroconductive resin composition and electronic parts using the same | HITACHI CHEMICAL CO LTD (JP) | 2006-12-13 | — | — | CN | disclosed |
| CN-1286918-C | Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | HITACHI CHEMICAL CO LTD (JP) | 2006-11-29 | — | — | CN | disclosed |
| US-20060180908-A1 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | YANO YASUHIRO | 2006-08-17 | — | — | US | disclosed |
| US-7061081-B2 | Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics | HITACHI CHEMICAL CO., LTD. (JP) | 2006-06-13 | — | — | US | disclosed |
| CN-1416452-A | Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | HITACHI CHEMICAL CO LTD (JP) | 2003-05-07 | — | — | CN | disclosed |
| US-20030082925-A1 | Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics | HITACHI CHEMICAL CO., LTD. (JP) | 2003-05-01 | — | — | US | disclosed |
| US-6492203-B1 | Semiconductor device and method of fabrication thereof | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-12-10 | — | — | US | disclosed |
| US-6404068-B1 | (A) A THERMOPLASTIC RESIN, (B) AN EPOXY RESIN, (C) A COUPLING AGENT, (D) A POWDERY INORGANIC FILLER, (E) A POWDER HAVING RUBBER ELASTICITY AND (F) AN ORGANIC SOLVENT; LOW WATER VAPOR PERMEABILITY | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-06-11 | — | — | US | disclosed |
| CN-1313882-A | Paste composition, protective film using the same, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2001-09-19 | — | — | CN | disclosed |
| EP-1114845-A1 | PASTE COMPOSITION, AND PROTECTIVE FILM AND SEMICONDUCTOR DEVICE BOTH OBTAINED WITH THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-07-11 | — | — | EP | disclosed |
| US-5212279-A | Hot-melt adhesive and its use in polyimide film and printed circuit board | HITACHI CHEMICAL CO., LTD. (JP) | 1993-05-18 | — | — | US | disclosed |
| EP-0017422-B1 | THERMOPLASTIC POLYAMIDEIMIDE COPOLYMERS AND METHOD OF PREPARATION | TORAY INDUSTRIES, INC. (JP) | 1983-11-30 | — | — | EP | disclosed |
| US-4299945-A | HEAT POLYMERIZATION OF AN AROMATIC DIAMINO COMPOUND AND AN AROMATIC TRIBASIC CARBOXYLIC ACID | TORAY INDUSTRIES, INC. (JP) | 1981-11-10 | — | — | US | disclosed |
| EP-0017422-A1 | Thermoplastic polyamideimide copolymers and method of preparation | TORAY INDUSTRIES, INC. (JP) | 1980-10-15 | — | — | EP | disclosed |