Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 3/20 | 0.35 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.35 |
| ▸ | FYN | P06241 | 1/20 | 0.35 |
| ▸ | MAOA | P21397 | 1/20 | 0.35 |
| ▸ | ACHE | P22303 | 1/20 | 0.35 |
| ▸ | AHR | P35869 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.33 |
| ▸ | GAA | P10253 | 2/20 | 0.33 |
| ▸ | RXRA | P19793 | 1/20 | 0.32 |
| ▸ | PPARG | P37231 | 1/20 | 0.32 |
| ▸ | PPARD | Q03181 | 1/20 | 0.32 |
| ▸ | PPARA | Q07869 | 1/20 | 0.32 |
| ▸ | ESR1 | P03372 | 2/20 | 0.32 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19259375 | 0.91 | CYP1A2 (0.41) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL16990771 | 0.90 | CYP1A2 (0.36) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL445634 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL19252585 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL73568 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| Ammonia Solution, Strong SCHEMBL1035827 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL1314570 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL911163 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| Phosphine SCHEMBL3288817 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE | |
| Hydrogen Sulfide SCHEMBL17372873 | 0.90 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 179 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115315453-A | Propylene copolymers obtained using transition metal bis (phenolate) catalyst complexes and homogeneous processes for producing the same | 埃克森美孚化学专利公司 | 2022-11-08 | — | — | CN | claimed |
| US-20260049172-A1 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME | SAMSUNG SDI CO LTD (KR) | 2026-02-19 | — | — | US | disclosed |
| US-20250382493-A1 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME | SAMSUNG SDI CO LTD (KR) | 2025-12-18 | — | — | US | disclosed |
| US-20250368838-A1 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING MULTICHIP PACKAGE AND MULTICHIP PACKAGE ENCAPSULATED USING THE SAME | SAMSUNG SDI CO LTD (KR) | 2025-12-04 | — | — | US | disclosed |
| US-20250289922-A1 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2025-09-18 | — | — | US | disclosed |
| US-20250236760-A1 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2025-07-24 | — | — | US | disclosed |
| CN-115996967-B | Preparation method of polyolefin-polystyrene multi-block copolymer | 株式会社LG化学 | 2025-05-30 | — | — | CN | disclosed |
| CN-114599755-B | Sheet for semiconductor device manufacture, method for manufacturing the same, and method for manufacturing semiconductor chip with film-like adhesive | 琳得科株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-114437502-B | Epoxy resin composition for encapsulating semiconductor device and semiconductor device | 三星SDI株式会社 | 2024-11-05 | — | — | CN | disclosed |
| CN-115210075-B | Method for manufacturing sheet for manufacturing semiconductor device | 琳得科株式会社 | 2024-10-29 | — | — | CN | disclosed |
| EP-0619827-B1 | ETHYLENE INTERPOLYMER POLYMERIZATIONS | DOW CHEMICAL CO (US) | 1996-06-12 | — | — | EP | disclosed |
| CN-1029440-C | Insulating substrate for manufacturing electric insulating coil | HITACHI LTD (JP) | 1995-08-02 | — | — | CN | disclosed |
| US-5384197-A | Impregnated polyepoxide resin | HITACHI, LTD. (JP) | 1995-01-24 | — | — | US | disclosed |
| CN-1025524-C | Electrically insulated coil and use thereof | HITACHI LTD (JP) | 1994-07-20 | — | — | CN | disclosed |
| CN-1079331-A | A kind of method of making electric insulation coil | HITACHI LTD (JP) | 1993-12-08 | — | — | CN | disclosed |
| CN-1079332-A | A kind of insulating substrate that is used to make electric insulation coil | HITACHI LTD (JP) | 1993-12-08 | — | — | CN | disclosed |
| CN-1064171-A | Electrically insulated coil, rotating electric machine, and coil manufacturing method | HITACHI LTD (JP) | 1992-09-02 | — | — | CN | disclosed |
| EP-0488275-A2 | Resin-impregnated superconducting magnet coil and process for it production | HITACHI, LTD. (JP) | 1992-06-03 | — | — | EP | disclosed |
| US-5075159-A | Binding polyfunctional epoxy resin, impregnation bifunctional epoxy resin | KOYAMA TOHRU (JP) | 1991-12-24 | — | — | US | disclosed |
| EP-0413179-A2 | Electrically insulated coil, electric rotating machine, and method of manufacturing same | HITACHI, LTD. (JP) | 1991-02-20 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260049172-A1 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME | RER1, CD209, RPS4Y1 | CYP1A2 1614/4885ERBB2 3315/4885FYN 3982/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.