SCHEMBL3775245

SCHEMBL3775245

C=C(CCO)C(=O)n1c(=O)n(C(=O)C(=C)CCO)c(=O)n(C(=O)C(=C)CCO)c1=O

nearest known ligand 0.30

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.30
ALDH1A1 P00352 1/20 0.30
ABL1 P00519 1/20 0.30
POLB P06746 1/20 0.30
ALPI P09923 1/20 0.30
GAA P10253 1/20 0.30
ALPG P10696 1/20 0.30
APEX1 P27695 1/20 0.30
CASP3 P42574 1/20 0.30
RECQL P46063 1/20 0.30
BLM P54132 1/20 0.30
CASP7 P55210 1/20 0.30
CASP6 P55212 1/20 0.30
MCL1 Q07820 1/20 0.30
RIN1 Q13671 1/20 0.30
TDP1 Q9NUW8 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3762507 0.87 CAMK2A (0.41)
SCHEMBL5355933 0.77 CAMK2A (0.32)
SCHEMBL624969 0.65 TDP1 (0.36) ALDH1A1TDP1
SCHEMBL16661 0.64
SCHEMBL7758820 0.64 TET2 (0.40)
SCHEMBL806469 0.64
SCHEMBL21794807 0.63
SCHEMBL22881137 0.63 TDP1 (0.43) KDM4ETDP1
SCHEMBL35589 0.62
SCHEMBL4532573 0.62 TET2 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4855215-A Photosetting polymer composition UBE INDUSTRIES, LTD. (JP) 1989-08-08 US claimed
CN-114245881-A Photosensitive resin composition 日产化学株式会社 2022-03-25 CN disclosed
CN-112639618-A Negative photosensitive resin composition 日产化学株式会社 2021-04-09 CN disclosed
WO-2021024928-A1 RESIN COMPOSITION 日産化学株式会社 2021-02-11 WO disclosed
WO-2021014956-A1 PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2021-01-28 WO disclosed
CN-105765458-B Negative photosensitive resin composition 日产化学工业株式会社 2020-12-29 CN disclosed
CN-111684358-A Photosensitive resin composition 日产化学株式会社 2020-09-18 CN disclosed
WO-2020044918-A1 NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2020-03-05 WO disclosed
CN-110573963-A Photosensitive resin composition 日产化学株式会社 2019-12-13 CN disclosed
WO-2019156000-A1 PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2019-08-15 WO disclosed
US-7851124-B2 Composition for forming wiring protective film and uses thereof MITSUI CHEMICALS, INC. (JP) 2010-12-14 US disclosed
US-7030170-B2 Photosensitive resin composition, dry film, and workpiece using the same MITSUI CHEMICALS, INC. (JP) 2006-04-18 US disclosed
US-20050170270-A1 Composition for forming wiring protective film and uses thereof MITSUI CHEMICALS, INC. (JP) 2005-08-04 US disclosed
US-20040247908-A1 Composition for forming wiring protective film and uses thereof MITSUI CHEMICALS, INC. (JP) 2004-12-09 US disclosed
US-20030176528-A1 Photosensitive resin composition, dry film, and workpiece using the same MITSUI CHEMICALS, INC. (JP) 2003-09-18 US disclosed
US-4855215-A Photosetting polymer composition UBE INDUSTRIES, LTD. (JP) 1989-08-08 US disclosed
US-4595745-A Polycondensation product of aromatic dicarboxylic acid component comprising acids and acid halides with organic diamine comprising diamino chalcone and ester or ether containing diamine and nonphotocrosslinkable diamine UBE INDUSTRIES, LTD. (JP) 1986-06-17 US disclosed
US-4558117-A Organic solvent-soluble photosensitive polyimide resin UBE INDUSTRIES, LTD. (JP) 1985-12-10 US disclosed