Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CAMK2A | Q9UQM7 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16661 | 0.78 | — | — | |
| SCHEMBL7758820 | 0.78 | TET2 (0.40) | CAMK2A | |
| SCHEMBL3775245 | 0.77 | KDM4E (0.30) | — | |
| SCHEMBL4532573 | 0.75 | TET2 (0.39) | CAMK2A | |
| Ethylene SCHEMBL7184477 | 0.75 | TET2 (0.39) | CAMK2A | |
| SCHEMBL10713423 | 0.75 | — | — | |
| SCHEMBL35589 | 0.75 | — | — | |
| SCHEMBL29150247 | 0.75 | — | — | |
| SCHEMBL30849720 | 0.75 | — | — | |
| SCHEMBL5698428 | 0.73 | GRIK1 (0.41) | CAMK2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110028670-A | Low-dielectric loss negative light-sensitive poly amic acid ester resin, resin combination, preparation method and application | 明士新材料有限公司 | 2019-07-19 | — | — | CN | claimed |
| CN-110028669-A | Negative photosensitive poly amic acid ester resin, resin combination, preparation method and application | 明士新材料有限公司 | 2019-07-19 | — | — | CN | claimed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| WO-2024148707-A1 | POLYIMIDE PRECURSOR AND SYNTHETIC METHOD THEREFOR, AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING POLYIMIDE PRECURSOR | 深圳先进电子材料国际创新研究院 | 2024-07-18 | — | — | WO | disclosed |
| US-20240101761-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-03-28 | — | — | US | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| CN-115755526-A | Photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2023-03-07 | — | — | CN | disclosed |
| US-20210294213-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-09-23 | — | — | US | disclosed |
| CN-110028670-A | Low-dielectric loss negative light-sensitive poly amic acid ester resin, resin combination, preparation method and application | 明士新材料有限公司 | 2019-07-19 | — | — | CN | disclosed |
| CN-110028669-A | Negative photosensitive poly amic acid ester resin, resin combination, preparation method and application | 明士新材料有限公司 | 2019-07-19 | — | — | CN | disclosed |
| US-20180373147-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-12-27 | — | — | US | disclosed |
| CN-106104381-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2016-11-09 | — | — | CN | disclosed |
| CN-104285184-A | Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2015-01-14 | — | — | CN | disclosed |
| US-7282323-B2 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-20050244739-A1 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | CAMK2A 2375/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | CAMK2A 2837/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.