Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL62378 | 0.90 | MAPT (0.34) | — | |
| SCHEMBL22264550 | 0.85 | — | — | |
| SCHEMBL61877 | 0.84 | GAA (0.31) | — | |
| SCHEMBL62380 | 0.73 | GAA (0.35) | — | |
| SCHEMBL1068958 | 0.72 | NPC1 (0.33) | NPC1 | |
| Methoxymethane SCHEMBL11812708 | 0.69 | MAPT (0.41) | NPC1 | |
| SCHEMBL61606 | 0.69 | MAPT (0.34) | NPC1 | |
| SCHEMBL1920771 | 0.69 | LMNA (0.34) | — | |
| SCHEMBL14764507 | 0.69 | LMNA (0.34) | NPC1 | |
| SCHEMBL377333 | 0.68 | NPC1 (0.30) | NPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 230 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4679489-A1 | TEMPORARY ADHESIVE CONTAINING SILICONE-BASED RESIN, AND PROCESSING METHOD FOR SUBSTRATE WITH CIRCUIT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4679497-A1 | LASER PEELING COMPOSITION, LAMINATE, AND PROCESSING METHOD FOR SUBSTRATE WITH CIRCUIT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4664197-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| US-12448485-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-21 | — | — | US | disclosed |
| US-20250298315-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-25 | — | — | US | disclosed |
| EP-1645909-A2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2006-04-12 | — | — | EP | disclosed |
| US-6899991-B2 | Photo-curable resin composition, patterning process, and substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-20040142276-A1 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-07-22 | — | — | US | disclosed |
| US-6590010-B2 | Containing units from 4,4'-(9H-fluoren-9-ylidene) bis((2-propenyl) phenol) | SHIN-ETSU CHEMICALS, CO., LTD. (JP) | 2003-07-08 | — | — | US | disclosed |
| US-20030113662-A1 | Photo-curable resin composition, patterning process, and substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-19 | — | — | US | disclosed |
| EP-1186624-B1 | Organosiloxane polymers and photo-curable resin compositions | SHINETSU CHEMICAL CO (JP) | 2003-03-05 | — | — | EP | disclosed |
| US-20020055550-A1 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2002-05-09 | — | — | US | disclosed |
| EP-1186624-A1 | Organosiloxane polymers and photo-curable resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-03-13 | — | — | EP | disclosed |
| EP-0057985-A2 | Method of permanently sizing polyester yarns and fabrics woven therewith | ROHM AND HAAS COMPANY (US) | 1982-08-18 | — | — | EP | disclosed |
| US-4059665-A | ACRYLIC COPOLYMER, POLYALKYLENE GLYCOL | ROHM AND HAAS COMPANY (US) | 1977-11-22 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | NPC1 3608/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | NPC1 3648/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.