⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5476009 | 0.87 | — | — | |
| SCHEMBL28732089 | 0.84 | ALDH1A1 (0.33) | — | |
| SCHEMBL28634280 | 0.84 | ALDH1A1 (0.33) | — | |
| SCHEMBL5147841 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL2968465 | 0.79 | — | — | |
| SCHEMBL15227661 | 0.70 | ALDH1A1 (0.30) | — | |
| SCHEMBL16136743 | 0.69 | — | — | |
| SCHEMBL29105368 | 0.69 | TSHR (0.40) | — | |
| SCHEMBL497040 | 0.67 | — | — | |
| SCHEMBL6553635 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-1163284-A | — | — | None | — | — | JP | disclosed |
| US-9873252-B2 | Printing device and printing method | RICOH COMPANY, LTD. (JP) | 2018-01-23 | — | — | US | disclosed |
| US-9868288-B2 | Cleaning liquid for inkjet recording apparatus, method for cleaning inkjet recording apparatus, recording method, and cleaning and filling liquid | RICOH COMPANY, LTD. (JP) | 2018-01-16 | — | — | US | disclosed |
| US-20170182770-A1 | PRINTING DEVICE AND PRINTING METHOD | RICOH COMPANY, LTD. (JP) | 2017-06-29 | — | — | US | disclosed |
| EP-3184307-A1 | PRINTING DEVICE AND PRINTING METHOD | Ricoh Company, Ltd. (JP) | 2017-06-28 | — | — | EP | disclosed |
| US-20170015102-A1 | CLEANING LIQUID FOR INKJET RECORDING APPARATUS, METHOD FOR CLEANING INKJET RECORDING APPARATUS, RECORDING METHOD, AND CLEANING AND FILLING LIQUID | RICOH COMPANY, LTD. (JP) | 2017-01-19 | — | — | US | disclosed |
| US-7847406-B2 | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device | RICOH COMPANY, LTD. (JP) | 2010-12-07 | — | — | US | disclosed |
| US-7059512-B2 | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device | RICOH COMPANY, LTD. (JP) | 2006-06-13 | — | — | US | disclosed |
| US-20060011703-A1 | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device | ARITA HITOSHI | 2006-01-19 | — | — | US | disclosed |
| US-20040129344-A1 | Semiconductor device with solder bumps with fewer occurrences of voids and cracks | RICOH COMPANY, LTD. (JP) | 2004-07-08 | — | — | US | disclosed |
| JP-H01163284-A | TACKY ADHESIVE FILM FOR CORROSION-PROTECTION OF STEEL PLATE | MARUNAGA KK | 1989-06-27 | — | — | JP | disclosed |