SCHEMBL3785392

SCHEMBL3785392

CCCCCCCC/C=C\CCCCCCCCCCN1C=NCC1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 3/20 0.44
FAAH O00519 6/20 0.42
TRPV1 Q8NER1 2/20 0.39
ALDH1A1 P00352 2/20 0.36
DUSP3 P51452 1/20 0.36
PTPN7 P35236 1/20 0.36
KDM4E B2RXH2 1/20 0.36
FFAR1 O14842 1/20 0.36
LMNA P02545 1/20 0.36
FABP3 P05413 1/20 0.36
CYP3A4 P08684 1/20 0.36
F7 P08709 1/20 0.36
CYP19A1 P11511 1/20 0.36
F3 P13726 1/20 0.36
FABP4 P15090 1/20 0.36
HPGD P15428 1/20 0.36
ALOX15 P16050 1/20 0.36
TSHR P16473 1/20 0.36
PTGS1 P23219 1/20 0.36
GNA15 P30679 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16306 1.00 MGLL (0.44) MGLLFAAHTRPV1ALDH1A1DUSP3
SCHEMBL16308 1.00 MGLL (0.44) MGLLFAAHTRPV1ALDH1A1DUSP3
Hydrochloric Acid SCHEMBL10940528 0.98 MGLL (0.43) MGLLFAAHTRPV1DUSP3PTPN7
Hydrochloric Acid SCHEMBL1230862 0.98 MGLL (0.43) MGLLFAAHTRPV1DUSP3PTPN7
Hydrochloric Acid SCHEMBL1230866 0.98 MGLL (0.43) MGLLFAAHTRPV1DUSP3PTPN7
Ammonia Solution, Strong SCHEMBL3388383 0.98 MGLL (0.43) MGLLFAAHTRPV1ALDH1A1DUSP3
Ammonia Solution, Strong SCHEMBL3388377 0.98 MGLL (0.43) MGLLFAAHTRPV1ALDH1A1DUSP3
Hydrochloric Acid SCHEMBL10940538 0.98 MGLL (0.43) MGLLFAAHTRPV1DUSP3PTPN7
SCHEMBL9814782 0.95 MGLL (0.41) MGLLFAAHTRPV1FABP3
Phosphoric Acid SCHEMBL8585411 0.92 MGLL (0.41) MGLLFAAHDUSP3FABP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8716207-B2 Solidification mechanism incorporating ionic liquids ECOLAB USA INC. (US) 2014-05-06 US claimed
US-20130324455-A1 SOLIDIFICATION MECHANISM INCORPORATING IONIC LIQUIDS ECOLAB USA INC. (US) 2013-12-05 US claimed
US-8481474-B1 Quaternized alkyl imidazoline ionic liquids used for enhanced food soil removal ECOLAB USA INC. (US) 2013-07-09 US claimed
EP-2253002-A2 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS Applied Nanotech Holdings, Inc. (US) 2010-11-24 EP claimed
US-20090242854-A1 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS APPLIED NANOTECH HOLDINGS, INC. (US) 2009-10-01 US claimed
WO-2009111393-A2 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS APPLIED NANOTECH HOLDINGS, INC. (US) 2009-09-11 WO claimed
US-12180439-B2 Alkyl amides for enhanced food soil removal and asphalt dissolution ECOLAB USA INC. (US) 2024-12-31 US disclosed
US-20240052271-A1 ALKYL AMIDES FOR ENHANCED FOOD SOIL REMOVAL AND ASPHALT DISSOLUTION ECOLAB USA INC. 2024-02-15 US disclosed
US-11834624-B2 Alkyl amides for enhanced food soil removal and asphalt dissolution ECOLAB USA INC. (US) 2023-12-05 US disclosed
EP-4244414-A1 ANTISTATIC SPANDEX AND GARMENTS THEREOF The LYCRA Company UK Limited (GB) 2023-09-20 EP disclosed
WO-2022103715-A1 ANTISTATIC SPANDEX AND GARMENTS THEREOF THE LYCRA COMPANY LLC (US) 2022-05-19 WO disclosed
EP-3286293-B1 CLEANING COMPOSITION WITH IONIC LIQUID JOHNSON & SON INC S C (US) 2020-06-17 EP disclosed
US-20190153362-A1 ALKYL AMIDES FOR ENHANCED FOOD SOIL REMOVAL AND ASPHALT DISSOLUTION ECOLAB USA INC. 2019-05-23 US disclosed
US-20130324455-A1 SOLIDIFICATION MECHANISM INCORPORATING IONIC LIQUIDS ECOLAB USA INC. (US) 2013-12-05 US disclosed
US-8506849-B2 Additives and modifiers for solvent- and water-based metallic conductive inks APPLIED NANOTECH HOLDINGS, INC. (US) 2013-08-13 US disclosed
US-8481474-B1 Quaternized alkyl imidazoline ionic liquids used for enhanced food soil removal ECOLAB USA INC. (US) 2013-07-09 US disclosed
US-20120152148-A1 NON-BUFFING WAX EMULSION COMPOSITION HONEYWELL INTERNATIONAL INC. (US) 2012-06-21 US disclosed
EP-2253002-A2 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS Applied Nanotech Holdings, Inc. (US) 2010-11-24 EP disclosed
US-20090242854-A1 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS APPLIED NANOTECH HOLDINGS, INC. (US) 2009-10-01 US disclosed
WO-2009111393-A2 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS APPLIED NANOTECH HOLDINGS, INC. (US) 2009-09-11 WO disclosed