SCHEMBL3800530

SCHEMBL3800530

Oc1ccccc1CCCCc1ccccc1O

nearest known ligand 0.65

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TAAR1 Q96RJ0 1/20 0.65
MPO P05164 5/20 0.63
SLC6A4 P31645 2/20 0.63
MGLL Q99685 1/20 0.62
HSPA5 P11021 1/20 0.62
TSHR P16473 2/20 0.54
CYP2D6 P10635 1/20 0.54
HIF1A Q16665 1/20 0.54
AKR1B1 P15121 1/20 0.52
CA12 O43570 5/20 0.52
CA2 P00918 5/20 0.52
CA9 Q16790 4/20 0.52
KDM4E B2RXH2 1/20 0.52
HSD17B10 Q99714 1/20 0.52
HTR1A P08908 1/20 0.52
HRH3 Q9Y5N1 1/20 0.52
IDO1 P14902 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8400524 0.97 MGLL (0.66) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL8401990 0.97 MGLL (0.66) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL8402231 0.97 MGLL (0.66) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL8398317 0.97 MGLL (0.66) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL8401980 0.97 MGLL (0.66) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL4967651 0.94 TAAR1 (0.65) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL10438887 0.92 TAAR1 (0.62) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL166339 0.91 TAAR1 (0.56) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL10751399 0.89 TAAR1 (0.54) TAAR1MPOSLC6A4MGLLHSPA5
SCHEMBL11208340 0.89 TAAR1 (0.54) TAAR1MPOSLC6A4MGLLHSPA5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118742611-A Insulating sheet, laminate, and semiconductor device 积水化学工业株式会社 2024-10-01 CN disclosed
WO-2023190863-A1 INSULATIVE SHEET, LAMINATE, AND SEMICONDUCTOR DEVICE 積水化学工業株式会社 2023-10-05 WO disclosed
EP-2840116-B1 RUBBER GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION CONTAINING RUBBER GRAFT COPOLYMER KANEKA CORP (JP) 2019-01-02 EP disclosed
US-10138314-B2 Rubber graft copolymer, and thermoplastic resin composition containing rubber graft copolymer KANEKA CORPORATION (JP) 2018-11-27 US disclosed
US-20150065651-A1 RUBBER GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION CONTAINING RUBBER GRAFT COPOLYMER KANEKA CORPORATION (JP) 2015-03-05 US disclosed
EP-2840116-A1 RUBBER GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION CONTAINING RUBBER GRAFT COPOLYMER Kaneka Corporation (JP) 2015-02-25 EP disclosed
CN-103988289-A Semiconductor chip with attached anisotropic electroconductive film, semiconductor wafer with attached anisotropic electroconductive film, and semiconductor device ASAHI KASEI E MATERIALS CORP 2014-08-13 CN disclosed
EP-2130674-B1 CORE SHEET FOR CARD MITSUBISHI PLASTICS INC (JP) 2014-08-06 EP disclosed
US-20100021740-A1 CORE SHEET FOR CARD MITSUBISHI PLASTICS, INC. (JP) 2010-01-28 US disclosed
EP-2130674-A1 CORE SHEET FOR CARD MITSUBISHI PLASTICS, INC. (JP) 2009-12-09 EP disclosed
US-4175175-A POLYSULFONES, POLYSULFONAMIDES UNION CARBIDE CORPORATION (US) 1979-11-20 US disclosed