Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRIM24 | O15164 | 1/20 | 0.64 |
| ▸ | TRIM33 | Q9UPN9 | 1/20 | 0.64 |
| ▸ | ERN1 | O75460 | 1/20 | 0.46 |
| ▸ | CA2 | P00918 | 5/20 | 0.43 |
| ▸ | CA1 | P00915 | 2/20 | 0.43 |
| ▸ | CDK4 | P11802 | 1/20 | 0.43 |
| ▸ | CCND1 | P24385 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 2/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | THRB | P10828 | 1/20 | 0.41 |
| ▸ | BLM | P54132 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28990965 | 0.85 | TRIM24 (0.42) | TRIM24TRIM33CA2CA1CDK4 | |
| Catechol SCHEMBL6545013 | 0.82 | MAPT (0.48) | CA2LMNAMEN1BLMKMT2A | |
| Salicyladehyde SCHEMBL27478581 | 0.80 | TRIM24 (0.90) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL28720472 | 0.80 | TRIM24 (0.90) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL1481752 | 0.80 | TRIM24 (0.90) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL11137059 | 0.80 | TRIM24 (0.90) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL3324723 | 0.80 | TRIM24 (0.90) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL6904372 | 0.80 | TRIM24 (0.90) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL901265 | 0.80 | TRIM24 (1.00) | TRIM24TRIM33ERN1CA2CA1 | |
| Salicyladehyde SCHEMBL15395 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1001054-B1 | Tin-copper alloy electroplating bath and plating process therewith | UYEMURA C & CO LTD (JP) | 2005-04-20 | — | — | EP | claimed |
| US-6508927-B2 | Bath contains an inorganic or organic acid or a water-soluble salt thereof, and one or more thioamide compounds or thiol compounds; forms a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts | C. UYEMURA & CO., LTD. (JP) | 2003-01-21 | — | — | US | claimed |
| US-20020104763-A1 | TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH | C. UYEMURA & CO., LTD. (JP) | 2002-08-08 | — | — | US | claimed |
| EP-1001054-A2 | Tin-copper alloy electroplating bath and plating process therewith | C. UYEMURA & CO, LTD (JP) | 2000-05-17 | — | — | EP | claimed |
| EP-3238861-B1 | SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL | SENJU METAL INDUSTRY CO (JP) | 2025-08-27 | — | — | EP | disclosed |
| US-10675719-B2 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-06-09 | — | — | US | disclosed |
| US-20180015572-A1 | Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint | SENJU METAL INDUSTRY CO., LTD. (JP) | 2018-01-18 | — | — | US | disclosed |
| EP-3238861-A1 | JOINING MEMBER, SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL, AND SOLDER JOINT | Senju Metal Industry Co., Ltd (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-8440066-B2 | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component | C. UYEMURA & CO., LTD. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-20100269894-A1 | TITANIUM DIOXIDE NANOTUBES AND THEIR USE IN PHOTOVOLTAIC DEVICES | BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION, ON BEHALF OF THE UNIVERSITY OF NEVADA (US) | 2010-10-28 | — | — | US | disclosed |
| US-20090275143-A1 | NANOSTRUCTURE ARRAY AND METHODS OF USE FOR EXPLOSIVE DETECTION | THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHE EDUCATION, ON BEHALF OF THE UNIVERSITY OF NEVADA, | 2009-11-05 | — | — | US | disclosed |
| US-20090098398-A1 | TIN ELECTROPLATING BATH, TIN PLATING FILM, TIN ELECTROPLATING METHOD, AND ELECTRONIC DEVICE COMPONENT | C. UYEMURA & CO., LTD. (JP) | 2009-04-16 | — | — | US | disclosed |
| EP-1001054-B1 | Tin-copper alloy electroplating bath and plating process therewith | UYEMURA C & CO LTD (JP) | 2005-04-20 | — | — | EP | disclosed |
| US-6508927-B2 | Bath contains an inorganic or organic acid or a water-soluble salt thereof, and one or more thioamide compounds or thiol compounds; forms a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts | C. UYEMURA & CO., LTD. (JP) | 2003-01-21 | — | — | US | disclosed |
| US-20020104763-A1 | TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH | C. UYEMURA & CO., LTD. (JP) | 2002-08-08 | — | — | US | disclosed |
| EP-1001054-A2 | Tin-copper alloy electroplating bath and plating process therewith | C. UYEMURA & CO, LTD (JP) | 2000-05-17 | — | — | EP | disclosed |