SCHEMBL3815253

SCHEMBL3815253

CCCCCCCCC(O)C(O)CCCCCCCC(=O)OCCCCCCOC(=O)CCCCCCCC(O)C(O)CCCCCCCC

nearest known ligand 0.67

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.67
MAPT P10636 1/20 0.57
PRSS1 P07477 1/20 0.56
PRSS2 P07478 1/20 0.56
PRSS3 P35030 1/20 0.56
NAAA Q02083 1/20 0.56
DNM1 Q05193 1/20 0.56
LMNA P02545 2/20 0.54
MEN1 O00255 2/20 0.54
KMT2A Q03164 2/20 0.54
KDM4E B2RXH2 1/20 0.54
DUSP3 P51452 1/20 0.54
HTR2C P28335 1/20 0.54
PAM P19021 2/20 0.51
ALDH1A1 P00352 1/20 0.51
PLA2G2A P14555 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3692173 1.00 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL17212329 1.00 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL6904892 1.00 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL7879521 0.97 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL9355818 0.94 DGKA (0.59) DGKAMEN1KMT2APAMALDH1A1
SCHEMBL4340206 0.90 DGKA (0.62) DGKAMAPTDNM1LMNAMEN1
SCHEMBL3487129 0.90 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL294266 0.90 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL3487063 0.90 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3
SCHEMBL3813041 0.90 DGKA (0.67) DGKAMAPTPRSS1PRSS2PRSS3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8586658-B2 Polylactic acid resin composition and molded item NEC CORPORATION (JP) 2013-11-19 US claimed
US-8710145-B2 Thermoplastic resin composition NEC CORPORATION (JP) 2014-04-29 US disclosed
US-8586658-B2 Polylactic acid resin composition and molded item NEC CORPORATION (JP) 2013-11-19 US disclosed
US-20090286926-A1 Thermoplastic Resin Composition NEC CORPORATION (JP) 2009-11-19 US disclosed
US-20090069463-A1 POLYLACTIC ACID RESIN COMPOSITION AND MOLDED ITEM NEC CORPORATION (JP) 2009-03-12 US disclosed
US-20090054559-A1 POLYLACTIC ACID RESIN COMPOSITION AND MOLDED ARTICLE NEC CORPORATION (JP) 2009-02-26 US disclosed