SCHEMBL381801

SCHEMBL381801

C=C(C)C(=O)OC.C=C(C)C(=O)OCCCCCCCCOc1ccc(C(=O)c2ccccc2)c(O)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.55
POLB P06746 1/20 0.55
APEX1 P27695 1/20 0.55
TDP1 Q9NUW8 1/20 0.55
HPGD P15428 2/20 0.53
ALDH1A1 P00352 1/20 0.53
LMNA P02545 1/20 0.53
CYP1A2 P05177 1/20 0.53
PGR P06401 1/20 0.53
CYP2D6 P10635 1/20 0.53
SLC6A2 P23975 1/20 0.53
PDE4A P27815 1/20 0.53
MAPK1 P28482 1/20 0.53
CYP2C19 P33261 1/20 0.53
HRH1 P35367 1/20 0.53
SLC6A3 Q01959 1/20 0.53
PDE4D Q08499 1/20 0.53
LSS P48449 2/20 0.46
MAOB P27338 11/20 0.45
MAOA P21397 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL380090 1.00 HTT (0.55) HTTPOLBAPEX1TDP1HPGD
SCHEMBL27708180 0.96 HTT (0.59) HTTPOLBAPEX1TDP1HPGD
SCHEMBL27590735 0.96 HTT (0.59) HTTPOLBAPEX1TDP1HPGD
SCHEMBL29384629 0.95 HPGD (0.58) HTTPOLBAPEX1TDP1HPGD
SCHEMBL93611 0.95 HPGD (0.58) HTTPOLBAPEX1TDP1HPGD
SCHEMBL29483466 0.94 LMNA (0.55) HTTPOLBAPEX1TDP1HPGD
SCHEMBL380370 0.94 LMNA (0.55) HTTPOLBAPEX1TDP1HPGD
SCHEMBL4194204 0.92 HPGD (0.58) HTTPOLBAPEX1TDP1HPGD
SCHEMBL38659958 0.92 HPGD (0.58) HTTPOLBAPEX1TDP1HPGD
SCHEMBL381637 0.91 LMNA (0.52) HTTPOLBAPEX1TDP1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2258761-B1 Polyester molding for use with a casing SONY CORP (JP) 2012-01-25 EP disclosed
EP-2258761-A1 Polyester molding for use with a casing Sony Corporation (JP) 2010-12-08 EP disclosed
EP-2175933-A1 TRIAZINE KINASE INHIBITORS Bristol-Myers Squibb Company (US) 2010-04-21 EP disclosed
US-7645823-B2 Resin composition, molded product from resin composition and method for preparing resin composition SONY CORPORATION (JP) 2010-01-12 US disclosed
US-7642310-B2 Polyester molding for use with a casing SONY CORPORATION (JP) 2010-01-05 US disclosed
WO-2009015254-A1 TRIAZINE KINASE INHIBITORS BRISTOL-MYERS SQUIBB COMPANY (US) 2009-01-29 WO disclosed
US-20080146697-A1 Polyester molding for use with a casing SONY CORPORATION (JP) 2008-06-19 US disclosed
US-20070270527-A1 Resin Composition, Molded Product From Resin Composition and Method for Preparing Resin Composition Lerner, David, Littenberg, Krumholz & Mentlik, LLP 2007-11-22 US disclosed
US-20070257239-A1 Resin Composition, Molded Product Obtained From Resin Composition and Method for Preparation of Resin Composition SONY CORPORATION (JP) 2007-11-08 US disclosed
US-7285589-B2 Polyester molding for use with a casing SONY CORPORATION (JP) 2007-10-23 US disclosed
EP-1698658-A1 RESIN COMPOSITION, SHAPED ARTICLE USING SUCH RESIN COMPOSITION AND METHOD FOR PRODUCING RESIN COMPOSITION Sony Corporation (JP) 2006-09-06 EP disclosed
EP-1690899-A1 RESIN COMPOSITION, MOLDING THEREOF AND PROCESS FOR PRODUCING THE RESIN COMPOSITION Sony Corporation (JP) 2006-08-16 EP disclosed
US-20030018099-A1 Polyester molding for use with a casing Lerner, David, Littenberg, Krumholz & Mentlik, LLP 2003-01-23 US disclosed
EP-1275690-A2 Polyester molding for use with a casing SONY CORPORATION (JP) 2003-01-15 EP disclosed