SCHEMBL382050

SCHEMBL382050

COC([SiH3])(CS)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9860479 0.79
SCHEMBL22612248 0.75
SCHEMBL329698 0.71
SCHEMBL8466926 0.69
SCHEMBL3953643 0.69
SCHEMBL1532317 0.69
SCHEMBL56927 0.67
SCHEMBL304421 0.67
SCHEMBL788247 0.67
SCHEMBL3913143 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO claimed
EP-4703405-A1 CRYSTALLINE POLYOXYALKYLENE-BASED POLYMER AND CURABLE COMPOSITION COMPRISING SAME Kaneka Corporation (JP) 2026-03-04 EP disclosed
EP-4682204-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2026-01-21 EP disclosed
EP-3929260-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-12-17 EP disclosed
EP-4484500-B1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, ADHESIVE AGENT COMPRISING THE COMPOSITION AND LAMINATED BODY KANEKA CORP (JP) 2025-11-26 EP disclosed
EP-4011978-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-11-19 EP disclosed
EP-3950832-B1 CURABLE COMPOSITION AND CURED PRODUCT KANEKA CORP (JP) 2025-10-22 EP disclosed
EP-3889206-B1 POLYOXYALKYLENE POLYMER AND CURABLE COMPOSITION KANEKA CORP (JP) 2025-10-15 EP disclosed
US-12378406-B2 Mixture of polyoxyalkylene polymers and curable composition KANEKA CORPORATION (JP) 2025-08-05 US disclosed
EP-3719086-B1 ACRYLIC POLYSILOXANE RESIN COATING MATERIAL COMPOSITION AND USE THEREOF CHUGOKU MARINE PAINTS (JP) 2025-05-07 EP disclosed
EP-2128103-A1 Aromatic secondary adhesive compound containing aminosilane Sika Technology AG (CH) 2009-12-02 EP disclosed
EP-2094618-A1 LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION Sika Technology AG (CH) 2009-09-02 EP disclosed
EP-1966264-A1 MOISTURE-CURING HOTMELT ADHESIVES COMPRISING AT LEAST ONE SILANE-FUNCTIONAL POLYURETHANE PREPOLYMER Sika Technology AG (CH) 2008-09-10 EP disclosed
WO-2008061981-A1 LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION SIKA TECHNOLOGY AG (CH) 2008-05-29 WO disclosed
EP-1923361-A1 Low temperature primer coating composition Sika Technology AG (CH) 2008-05-21 EP disclosed
WO-2007074143-A1 MOISTURE-CURING HOTMELT ADHESIVES COMPRISING AT LEAST ONE SILANE-FUNCTIONAL POLYURETHANE PREPOLYMER SIKA TECHNOLOGY AG (CH) 2007-07-05 WO disclosed
EP-1801138-A1 Humidity curing hot melt adhesive comprising at least a silane functional polyurethane prepolymer Sika Technology AG (CH) 2007-06-27 EP disclosed
WO-1998045368-A1 OLEFIN (CO-)POLYMER COMPOSITIONS AND METHOD OF PRODUCING THE SAME CHISSO CORPORATION (JP) 1998-10-15 WO disclosed
EP-0564004-B1 A highly stereoregular polypropylene CHISSO CORP (JP) 1996-09-25 EP disclosed
EP-0564004-A1 A highly stereoregular polypropylene CHISSO CORPORATION (JP) 1993-10-06 EP disclosed