Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 8/20 | 0.62 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.62 |
| ▸ | MEN1 | O00255 | 1/20 | 0.62 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.62 |
| ▸ | TSHR | P16473 | 1/20 | 0.62 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.62 |
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | GNAI3 | P08754 | 1/20 | 0.44 |
| ▸ | GNAO1 | P09471 | 1/20 | 0.44 |
| ▸ | GNAI1 | P63096 | 1/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9296449 | 1.00 | DNM1 (0.62) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL18059884 | 0.95 | DNM1 (0.55) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL27620096 | 0.95 | DNM1 (0.55) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL21891269 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL24969585 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL24294234 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL22618484 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL22923343 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL21984825 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL8309033 | 0.95 | DNM1 (0.68) | DNM1ALDH1A1MEN1KMT2ATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2097464-B1 | POLYAMIDE POLYOLS AND POLYURETHANES, METHODS FOR MAKING AND USING, AND PRODUCTS MADE THEREFROM | ARIZONA CHEM (US) | 2013-09-11 | — | — | EP | claimed |
| US-20080223519-A1 | POLYAMIDE POLYOLS AND POLYURETHANES, METHODS FOR MAKING AND USING, AND PRODUCTS MADE THEREFROM | BANK OF AMERICA, N.A. | 2008-09-18 | — | — | US | claimed |
| US-10882947-B2 | Rapid curing epoxy adhesive compositions | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2021-01-05 | — | — | US | disclosed |
| US-20170088664-A1 | RAPID CURING EPOXY ADHESIVE COMPOSITIONS | 3M INNOVATIVE PROPERTIES COMPANY | 2017-03-30 | — | — | US | disclosed |
| EP-2957584-B1 | RAPID CURING EPOXY ADHESIVE COMPOSITIONS | 3M INNOVATIVE PROPERTIES CO (US) | 2017-03-01 | — | — | EP | disclosed |
| EP-2957584-A1 | Rapid curing epoxy adhesive compositions | 3M Innovative Properties Company (US) | 2015-12-23 | — | — | EP | disclosed |
| WO-2015195775-A1 | RAPID CURING EPOXY ADHESIVE COMPOSITIONS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2015-12-23 | — | — | WO | disclosed |
| US-20150118480-A1 | LOW DENSITY EPOXY COMPOSITION WITH LOW WATER UPTAKE | 3M INNOVATIVE PROPERTIES COMPANY | 2015-04-30 | — | — | US | disclosed |
| EP-2653486-B1 | Low density epoxy composition with low water uptake | 3M INNOVATIVE PROPERTIES CO (US) | 2014-12-03 | — | — | EP | disclosed |
| WO-2013158517-A1 | LOW DENSITY EPOXY COMPOSITION WITH LOW WATER UPTAKE | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2013-10-24 | — | — | WO | disclosed |
| EP-2653486-A1 | Low density epoxy composition with low water uptake | 3M Innovative Properties Company (US) | 2013-10-23 | — | — | EP | disclosed |
| US-4713440-A | BINDERS FOR HEAT CURABLE ELECTROCOATING FINISHES | BASF AKTIENGESELLSCHAFT (DE) | 1987-12-15 | — | — | US | disclosed |
| EP-0229114-A1 | THERMOSETTING ADHESIVES FOR USE WITH HEAT-RECOVERABLE CLOSURES | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-07-22 | — | — | EP | disclosed |
| WO-1987000190-A1 | THERMOSETTING ADHESIVES FOR USE WITH HEAT-RECOVERABLE CLOSURES | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-01-15 | — | — | WO | disclosed |
| EP-0027727-B1 | POLYAMIDES SUITABLE FOR USE AS HOT-MELT ADHESIVES, PROCESS FOR THEIR PRODUCTION, AND ADHESIVE COMPOSITIONS COMPRISING THEM | RAYCHEM LIMITED (GB) | 1985-06-19 | — | — | EP | disclosed |
| US-4517340-A | POLYAMIDE, EPOXY RESIN, ADDITION COPOLYMER BLEND | RAYCHEM CORPORATION (US) | 1985-05-14 | — | — | US | disclosed |
| US-4378448-A | ADDITION-CONDENSATION COPOLYMER | RAYCHEM CORPORATION (US) | 1983-03-29 | — | — | US | disclosed |
| EP-0027727-A1 | Polyamides suitable for use as hot-melt adhesives, process for their production, and adhesive compositions comprising them | RAYCHEM LIMITED (GB) | 1981-04-29 | — | — | EP | disclosed |
| US-4181775-A | HOT MELT, POLYAMIDE, WAC, HEAT SHRINKABLE | N.V. RAYCHEM S.A. (BE) | 1980-01-01 | — | — | US | disclosed |
| US-4018733-A | Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide | RAYCHEM CORPORATION (US) | 1977-04-19 | — | — | US | disclosed |