SCHEMBL3835252

SCHEMBL3835252

CC(C)N(CCN(C=O)C1CC(C)(C)NC(C)(C)C1)C(C)C

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ADH1A P07327 3/20 0.34
ADH1C P00326 2/20 0.34
ADH4 P08319 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28012329 0.91 ADH1A (0.41) ADH1AADH1CADH4
SCHEMBL3301547 0.88 ADH1A (0.41) ADH1AADH1CADH4
SCHEMBL4099856 0.83 ADH1A (0.35) ADH1AADH1CADH4
SCHEMBL14142383 0.82 ADH1A (0.44) ADH1AADH1CADH4
SCHEMBL28012330 0.81 ADH1A (0.32) ADH1AADH1CADH4
SCHEMBL77345 0.80 ADH1A (0.51) ADH1AADH1CADH4
SCHEMBL20200266 0.80 ADH1A (0.51) ADH1AADH1CADH4
SCHEMBL4094273 0.80 ADH1A (0.55) ADH1AADH1CADH4
SCHEMBL14263284 0.80 ADH1A (0.51) ADH1AADH1CADH4
SCHEMBL4087148 0.79 ADH1A (0.39) ADH1AADH1CADH4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2930210-B1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE ZEON CORP (JP) 2023-01-25 EP disclosed
US-10707442-B2 Composite gas barrier multilayer body, method for producing the same, and composite electrode ZEON CORPORATION (JP) 2020-07-07 US disclosed
EP-3089551-B1 SEALING FILM, ORGANIC ELECTROLUMINESCENT DISPLAY, AND ORGANIC SEMICONDUCTOR DEVICE ZEON CORP (JP) 2020-04-15 EP disclosed
US-10559778-B2 Composite gas barrier laminate and method for producing same ZEON CORPORATION (JP) 2020-02-11 US disclosed
US-20190334116-A1 METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2019-10-31 US disclosed
US-10374190-B2 Sealing film, organic electroluminescent display, and organic semiconductor device ZEON CORPORATION (JP) 2019-08-06 US disclosed
US-20180102500-A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2018-04-12 US disclosed
EP-3277055-A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE Zeon Corporation (JP) 2018-01-31 EP disclosed
EP-2623526-B1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP, AND USE THEREFOR ZEON CORP (JP) 2017-07-26 EP disclosed
US-20170037157-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR ZEON CORPORATION (JP) 2017-02-09 US disclosed
EP-2930210-A1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE Zeon Corporation (JP) 2015-10-14 EP disclosed
US-20150249228-A1 COMPOSITE GAS BARRIER MULTILAYER BODY, METHOD FOR PRODUCING THE SAME, AND COMPOSITE ELECTRODE ZEON CORPORATION (JP) 2015-09-03 US disclosed
EP-2907657-A1 COMPOSITE GAS BARRIER LAMINATE AND METHOD FOR PRODUCING SAME, AND COMPOSITE ELECTRODE Zeon Corporation (JP) 2015-08-19 EP disclosed
US-20130244367-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR ZEON CORPORATION (JP) 2013-09-19 US disclosed
EP-2623526-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP, AND USE THEREFOR Zeon Corporation (JP) 2013-08-07 EP disclosed
US-20130008506-A1 RESIN COMPOSITION FOR ENCAPSULATING SOLAR CELL AND SOLAR MODULE ZEON CORPORATION (JP) 2013-01-10 US disclosed
EP-2532692-A1 RESIN COMPOSITION FOR SEALING SOLAR CELL ELEMENT, AND SOLAR CELL MODULE Zeon Corporation (JP) 2012-12-12 EP disclosed
EP-1903074-B1 RESIN COMPOSITION ZEON CORP (JP) 2009-10-14 EP disclosed
US-20090118400-A1 RESIN COMPOSITION ZEON CORPORATION (JP) 2009-05-07 US disclosed
EP-1903074-A1 RESIN COMPOSITION ZEON CORPORATION (JP) 2008-03-26 EP disclosed