SCHEMBL3843560

SCHEMBL3843560

Brc1ccc(Oc2cccc(Oc3ccc(Br)cc3)c2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.60
SMN1; SMN2 Q16637 2/20 0.60
ALDH1A1 P00352 2/20 0.60
MEN1 O00255 2/20 0.60
KMT2A Q03164 2/20 0.60
MITF O75030 1/20 0.60
GAA P10253 1/20 0.60
GFER P55789 1/20 0.60
NLRP1 Q9C000 1/20 0.60
NOD2 Q9HC29 1/20 0.60
MAOB P27338 4/20 0.50
FURIN P09958 2/20 0.50
F2 P00734 1/20 0.50
F10 P00742 1/20 0.50
MAOA P21397 1/20 0.50
LTA4H P09960 1/20 0.46
TSHR P16473 1/20 0.46
LMNA P02545 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
MCL1 Q07820 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3842372 1.00 MAPT (0.60) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL30633275 0.91 MAOB (0.55) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL3840708 0.91 MAOB (0.55) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL27443501 0.89 MAPT (0.50) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL22010911 0.89 SMN1; SMN2 (0.67) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL31033289 0.89 SMN1; SMN2 (0.67) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL3838956 0.88 SMN1; SMN2 (0.58) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL3839157 0.85 ALDH1A1 (0.54) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL3838974 0.85 ALDH1A1 (0.54) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL8591398 0.85 ALDH1A1 (0.67) MAPTSMN1; SMN2ALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6884862-B2 Polymer, process for production, composition for film formation containing the same, method of film formation, and insulating film JSR CORPORATION (JP) 2005-04-26 US claimed
US-7556860-B2 Laminate and method of forming the same, insulating film, and semiconductor device JSR CORPORATION (JP) 2009-07-07 US disclosed
EP-1245638-B1 Composition for insulating film formation JSR CORP (JP) 2009-01-14 EP disclosed
EP-1298176-B1 Stacked film insulating film and substrate for semiconductor JSR CORP (JP) 2007-01-03 EP disclosed
US-20060216531-A1 Laminate and method of forming the same, insulating film, and semiconductor device JSR CORPORATION (JP) 2006-09-28 US disclosed
US-20060210812-A1 Insulating film and method of forming the same JSR CORPORATION (JP) 2006-09-21 US disclosed
EP-1696478-A1 INSULATING FILM, METHOD FOR FORMING SAME AND COMPOSITION FOR FORMING FILM JSR Corporation (JP) 2006-08-30 EP disclosed
EP-1679184-A1 LAMINATE AND METHOD FOR FORMATION THEREOF, INSULATING FILM, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FORMING FILM JSR Corporation (JP) 2006-07-12 EP disclosed
US-6884862-B2 Polymer, process for production, composition for film formation containing the same, method of film formation, and insulating film JSR CORPORATION (JP) 2005-04-26 US disclosed
US-6852370-B2 Composition for film formation and material for insulating film formation JSR CORPORATION (JP) 2005-02-08 US disclosed
US-6824833-B2 STACKED DIELECTRIC JSR CORPORATION (JP) 2004-11-30 US disclosed
EP-1254917-B1 Polymer comprising acetylene repeating units, process for the production, composition for film formation containing the same, method of film formation and insulating film JSR CORP (JP) 2004-06-30 EP disclosed
US-20030077461-A1 Stacked film, insulating film and substrate for semiconductor JSR CORPORATION (JP) 2003-04-24 US disclosed
EP-1298176-A2 Stacked film insulating film and substrate for semiconductor JSR Corporation (JP) 2003-04-02 EP disclosed
EP-1254917-A1 Polymer comprising acetylene repeating units, process for the production, composition for film formation containing the same, method of film formation and insulating film JSR Corporation (JP) 2002-11-06 EP disclosed
US-20020161173-A1 Polymer, process for production, composition for film formation containing the same, method of film formation, and insulating film JSR CORPORATION (JP) 2002-10-31 US disclosed
EP-1245638-A1 Composition for insulating film formation JSR Corporation (JP) 2002-10-02 EP disclosed