SCHEMBL384493

SCHEMBL384493

CC(C)CCC(C)OC(=O)c1ccc(N(C)C)cc1

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 10/20 0.47
▸ HSD17B10 Q99714 3/20 0.47
▸ TSHR P16473 2/20 0.47
▸ LMNA P02545 2/20 0.47
▸ CYP3A4 P08684 1/20 0.47
▸ HPGD P15428 6/20 0.47
▸ MAPT P10636 6/20 0.47
▸ RAB9A P51151 7/20 0.46
▸ NPC1 O15118 5/20 0.46
▸ KDM4E B2RXH2 4/20 0.46
▸ SMN1; SMN2 Q16637 3/20 0.46
▸ GAA P10253 1/20 0.46
▸ MAPK1 P28482 1/20 0.46
▸ HTT P42858 1/20 0.44
▸ HDAC3 O15379 1/20 0.44
▸ HDAC4 P56524 1/20 0.44
▸ HDAC1 Q13547 1/20 0.44
▸ HDAC7 Q8WUI4 1/20 0.44
▸ HDAC2 Q92769 1/20 0.44
▸ HDAC10 Q969S8 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29150408 0.91 TSHR (0.51) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL27858701 0.88 ALDH1A1 (0.53) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL20306424 0.85 ALDH1A1 (0.48) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL4266120 0.84 ALDH1A1 (0.52) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL38612 0.82 ALDH1A1 (0.55) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL27402255 0.80 ALDH1A1 (0.52) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL4457563 0.80 CA12 (0.63) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL59872 0.79 HSD17B10 (0.60) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL16348824 0.78 ALDH1A1 (0.54) ALDH1A1HSD17B10TSHRLMNACYP3A4
SCHEMBL20310329 0.78 ALDH1A1 (0.40) ALDH1A1HSD17B10TSHRLMNACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12473471-B2 Laminate, production method therefor, and automotive exterior material MITSUBISHI CHEMICAL CORPORATION (JP) 2025-11-18 — — US disclosed
WO-2024063130-A1 RESIN COMPOSITION, CURED RESIN PRODUCT AND MANUFACTURING METHOD OF CURED RESIN PRODUCT 三井化学株式会社 2024-03-28 — — WO disclosed
EP-4082781-A1 LAMINATED BODY AND PRODUCTION METHOD THEREFOR, AND AUTOMOTIVE EXTERIOR MATERIAL Mitsubishi Chemical Corporation (JP) 2022-11-02 — — EP disclosed
WO-2022211082-A1 PHOTOSENSITIVE FILM LAMINATED BODY, CURED PRODUCT, AND PRINTED CIRCUIT BOARD 太陽インキ製造株式会社 2022-10-06 — — WO disclosed
US-20220298397-A1 LAMINATE, PRODUCTION METHOD THEREFOR, AND AUTOMOTIVE EXTERIOR MATERIAL MITSUBISHI CHEMICAL CORPORATION (JP) 2022-09-22 — — US disclosed
CN-113249037-A Photocurable adhesive composition for optical film, photocurable adhesive layer for optical film, optical member and display device 三星SDI株式会社 2021-08-13 — — CN disclosed
US-20210246341-A1 PHOTOCURABLE ADHESIVE COMPOSITION FOR OPTICAL FILM, PHOTOCURABLE ADHESIVE LAYER FOR OPTICAL FILM, OPTICAL MEMBER, AND DISPLAY APPARATUS SAMSUNG SDI CO., LTD. (KR) 2021-08-12 — — US disclosed
WO-2021132148-A1 LAMINATED BODY AND PRODUCTION METHOD THEREFOR, AND AUTOMOTIVE EXTERIOR MATERIAL 三菱ケミカル株式会社 2021-07-01 — — WO disclosed
WO-2020189390-A1 ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT LAYER, AND ADHESIVE SHEET 日東電工株式会社 2020-09-24 — — WO disclosed
EP-3323863-B1 ACTIVE LIGHT RAY-CURABLE INKJET INK AND INKJET RECORDING METHOD KONICA MINOLTA INC (JP) 2020-06-17 — — EP disclosed
EP-1923741-A2 Photosensitive composition TAIYO INK MFG. CO., LTD. (JP) 2008-05-21 — — EP disclosed
US-20080113297-A1 PHOTOSENSITIVE COMPOSITION TAIYO INK MFG. CO., LTD. (JP) 2008-05-15 — — US disclosed
US-20080096133-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED CIRCUIT BOARD OBTAINED USING THE SAME TAIYO INK MFG. CO., LTD. (JP) 2008-04-24 — — US disclosed
EP-1887425-A1 PHOTOCURING/THERMOSETTING RESIN COMPOSITION, CURING/SETTING PRODUCT THEREOF AND PRINTED WIRING BOARD OBTAINED USING THE SAME Taiyo Ink Manufacturing Co. Ltd (JP) 2008-02-13 — — EP disclosed
US-20080021174-A1 Radiation-Curable Resin Composition for Shape-Replication, Sheet for Shape-Replication, and Shape-Replicated Material DAINIPOON INK AND CHEMICALS INC. (JP) 2008-01-24 — — US disclosed
CN-1989161-A Actinic radiation-curable resin composition for shaping, shaping sheet, and shaped product DAINIPPON INK & CHEMICALS (JP) 2007-06-27 — — CN disclosed
CN-1981237-A Photocurable/thermosetting resin composition, dry film using same, and cured product thereof TAIYO INK MFG CO LTD (JP) 2007-06-13 — — CN disclosed
US-20070122742-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, DRY FILM USING THE SAME, AND CURED PRODUCT THEREOF TAIYO INK MFG. CO., LTD. (JP) 2007-05-31 — — US disclosed
EP-1772472-A1 ACTINIC RADIATION-CURABLE RESIN COMPOSITION FOR SHAPING, SHAPING SHEET, AND SHAPED PRODUCT DAINIPPON INK AND CHEMICALS, INC. (JP) 2007-04-11 — — EP disclosed
EP-1298155-A1 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board San-Ei Kagaku Co. Ltd. (JP) 2003-04-02 — — EP disclosed
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