SCHEMBL3853665

SCHEMBL3853665

[Cr].[Cu].[Ni].[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3853667 1.00
SCHEMBL28340465 0.89
SCHEMBL28148616 0.89
SCHEMBL9309551 0.89
SCHEMBL20236052 0.89
SCHEMBL3853601 0.89
SCHEMBL3853598 0.89
SCHEMBL28408484 0.89
SCHEMBL29198611 0.89
SCHEMBL38657446 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 119 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250149318-A1 HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME TOSOH SMD, INC. (US) 2025-05-08 US claimed
CN-115896538-B High-performance copper-nickel-silicon-chromium alloy plate and processing method and application thereof 中色正锐(山东)铜业有限公司 2024-04-26 CN claimed
US-20230260769-A1 HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME TOSOH SMD, INC. 2023-08-17 US claimed
CN-115354189-B Copper-nickel-chromium-silicon material for injection mold and blow mold and preparation method thereof 陕西斯瑞新材料股份有限公司 2023-05-12 CN claimed
CN-115896538-A High-performance copper-nickel-silicon-chromium alloy plate and processing method and application thereof 中色奥博特铜铝业有限公司 2023-04-04 CN claimed
US-11515132-B2 Physical vapor deposition processing systems target cooling APPLIED MATERIALS, INC. (US) 2022-11-29 US claimed
CN-115354189-A Copper-nickel-chromium-silicon material for injection mold and blow mold and preparation method thereof 陕西斯瑞新材料股份有限公司 2022-11-18 CN claimed
CN-113755717-B High-hardness copper-nickel-silicon-chromium alloy for amorphous strip cooling copper roller and preparation method thereof 武汉科技大学 2022-04-08 CN claimed
CN-113755717-A High-hardness copper-nickel-silicon-chromium alloy for amorphous strip cooling copper roller and preparation method thereof 武汉科技大学 2021-12-07 CN claimed
US-11037769-B2 Physical vapor deposition processing systems target cooling APPLIED MATERIALS, INC. (US) 2021-06-15 US claimed
US-20210078073-A1 COPPER ALLOY COMPOSITIONS HAVING ENHANCED THERMAL CONDUCTIVITY AND WEAR RESISTANCE Materion Corporation (US) 2021-03-18 US claimed
US-20200266039-A1 Physical Vapor Deposition Processing Systems Target Cooling APPLIED MATERIALS, INC. (US) 2020-08-20 US claimed
US-10685821-B2 Physical vapor deposition processing systems target cooling APPLIED MATERIALS, INC. (US) 2020-06-16 US claimed
CN-109182795-B Preparation method of high-strength high-conductivity rare earth copper-nickel-silicon-chromium alloy 北京科技大学 2020-06-05 CN claimed
EP-3565912-A1 PISTON COMPRESSION RINGS OF COPPER ALLOYS Materion Corporation (US) 2019-11-13 EP claimed
US-20190057851-A1 Physical Vapor Deposition Processing Systems Target Cooling APPLIED MATERIALS, INC. 2019-02-21 US claimed
US-20180195611-A1 PISTON COMPRESSION RINGS OF COPPER ALLOYS Materion Corporation 2018-07-12 US claimed
EP-0765734-B1 Molding Arrangement for the Manufacture of Molds for Contact Lenses JOHNSON & JOHNSON VISION PROD (US) 2001-12-19 EP claimed
US-5702735-A Molding arrangement to achieve short mold cycle time JOHNSON & JOHNSON VISION PRODUCTS, INC. (US) 1997-12-30 US claimed
EP-0765734-A2 Molding arrangement to achieve short mold cycle time JOHNSON &amp; JOHNSON VISION PRODUCTS, INC. (US) 1997-04-02 EP claimed