⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3853665 | 1.00 | — | — | |
| SCHEMBL28340465 | 0.89 | — | — | |
| SCHEMBL28148616 | 0.89 | — | — | |
| SCHEMBL9309551 | 0.89 | — | — | |
| SCHEMBL20236052 | 0.89 | — | — | |
| SCHEMBL3853601 | 0.89 | — | — | |
| SCHEMBL3853598 | 0.89 | — | — | |
| SCHEMBL28408484 | 0.89 | — | — | |
| SCHEMBL29198611 | 0.89 | — | — | |
| SCHEMBL38657446 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4623123-A1 | DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO COPPER ALLOY BACKING PLATE | HONEYWELL INTERNATIONAL INC. (US) | 2025-10-01 | — | — | EP | claimed |
| CN-119347325-A | Copper-chromium-nickel-silicon alloy heat processing treatment process | 丹东华强有色金属加工有限公司 | 2025-01-24 | — | — | CN | claimed |
| WO-2024147983-A1 | DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO COPPER ALLOY BACKING PLATE | HONEYWELL INTERNATIONAL INC. (US) | 2024-07-11 | — | — | WO | claimed |
| US-20240229225-A1 | DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO COPPER ALLOY BACKING PLATE | SOLSTICE ADVANCED MATERIALS US, INC. | 2024-07-11 | — | — | US | claimed |
| CN-115896538-B | High-performance copper-nickel-silicon-chromium alloy plate and processing method and application thereof | 中色正锐(山东)铜业有限公司 | 2024-04-26 | — | — | CN | claimed |
| CN-116875782-A | Copper-chromium-nickel-silicon alloy backboard and processing method and application thereof | 宁波江丰电子材料股份有限公司 | 2023-10-13 | — | — | CN | claimed |
| CN-115354189-B | Copper-nickel-chromium-silicon material for injection mold and blow mold and preparation method thereof | 陕西斯瑞新材料股份有限公司 | 2023-05-12 | — | — | CN | claimed |
| CN-115354189-A | Copper-nickel-chromium-silicon material for injection mold and blow mold and preparation method thereof | 陕西斯瑞新材料股份有限公司 | 2022-11-18 | — | — | CN | claimed |
| CN-114369802-A | Machining method of target assembly | 宁波江丰电子材料股份有限公司 | 2022-04-19 | — | — | CN | claimed |
| CN-113957396-A | Machining method of target assembly | 宁波江丰电子材料股份有限公司 | 2022-01-21 | — | — | CN | claimed |
| CN-109590473-B | Preparation method of porous titanium-based drug delivery atomizing core and atomizing heating component | 北京科技大学 | 2020-07-17 | — | — | CN | claimed |
| CN-111321361-A | Manufacturing method of copper-chromium-nickel-silicon alloy back plate for sputtering target material | 宁波江丰电子材料股份有限公司 | 2020-06-23 | — | — | CN | claimed |
| CN-109182795-B | Preparation method of high-strength high-conductivity rare earth copper-nickel-silicon-chromium alloy | 北京科技大学 | 2020-06-05 | — | — | CN | claimed |
| CN-102108459-B | High-strength nickel-chromium-silicon-copper alloy material and processing technology thereof | Shenyang xinggong copper industry co ltd | 2013-04-24 | — | — | CN | claimed |
| US-20260139362-A1 | COBALT-NIOBIUM ALLOY SPUTTERING TARGET ASSEMBLY AND METHOD OF MAKING | HONEYWELL INT INC (US) | 2026-05-21 | — | — | US | disclosed |
| US-20250327171-A1 | COBALT-TANTALUM ALLOY SPUTTERING TARGET ASSEMBLY AND METHOD OF MAKING | SOLSTICE ADVANCED MATERIALS US, INC. | 2025-10-23 | — | — | US | disclosed |
| US-20250327172-A1 | COBALT-TITANIUM ALLOY SPUTTERING TARGET ASSEMBLY AND METHOD OF MAKING | SOLSTICE ADVANCED MATERIALS US, INC. | 2025-10-23 | — | — | US | disclosed |
| US-20090229975-A1 | Target formed of Sintering-Resistant Material of High-Melting Point Metal Alloy, High-Melting Point Metal Silicide, High-Melting Point Metal Carbide, High-Melting Point Metal Nitride, or High-Melting Point Metal Boride, Process for Producing the Target, Assembly of the Sputtering Target-Backing Plate, and Process for Producing the Same | NIPPON MINING & METALS CO., LTD. (JP) | 2009-09-17 | — | — | US | disclosed |
| US-20090183803-A1 | COPPER-NICKEL-SILICON ALLOYS | GBC METALS, LLC | 2009-07-23 | — | — | US | disclosed |
| WO-2009082695-A1 | COPPER-NICKEL-SILICON ALLOYS | GBC METALS LLC (US) | 2009-07-02 | — | — | WO | disclosed |