SCHEMBL38654384

SCHEMBL38654384

CCCCCCCC(CC[Si](OC)(OC)OC)CC1CO1

nearest known ligand 0.40

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.40
TDP1 Q9NUW8 1/20 0.38
LMNA P02545 2/20 0.37
SPHK1 Q9NYA1 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.33
EPHX1 P07099 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28282694 0.98 ALDH1A1 (0.41) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL11769136 0.82 ALDH1A1 (0.50) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL16628556 0.81 ALDH1A1 (0.54) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL29184226 0.81 ALDH1A1 (0.54) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL10317758 0.81 ALDH1A1 (0.54) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL28188909 0.79 ALDH1A1 (0.50) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL29184180 0.78 ALDH1A1 (0.57) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
Water SCHEMBL19713221 0.77 ALDH1A1 (0.45) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL11694889 0.77 ALDH1A1 (0.53) ALDH1A1TDP1LMNASPHK1SMN1; SMN2
SCHEMBL25232100 0.77 ALDH1A1 (0.43) ALDH1A1TDP1LMNASPHK1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122037138-A Modified epoxy resin, preparation method thereof, epoxy plastic package material and application 深圳先进电子材料国际创新研究院 2026-05-15 CN claimed
CN-122037138-A Modified epoxy resin, preparation method thereof, epoxy plastic package material and application 深圳先进电子材料国际创新研究院 2026-05-15 CN disclosed