SCHEMBL3870157

SCHEMBL3870157

O=Nc1ccccc1S(=O)(=O)O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MYC P01106 1/20 0.41
CYP1A2 P05177 1/20 0.41
TSHR P16473 2/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
TTR P02766 2/20 0.40
FABP4 P15090 1/20 0.40
CCNA2 P20248 1/20 0.40
CDK2 P24941 1/20 0.40
MAPK14 Q16539 1/20 0.40
NR4A1 P22736 1/20 0.39
SUMO2 P61956 2/20 0.38
SUMO1 P63165 2/20 0.38
SENP7 Q9BQF6 2/20 0.38
SENP2 Q9HC62 2/20 0.38
SENP1 Q9P0U3 2/20 0.38
SENP3 Q9H4L4 1/20 0.38
CTRB1 P17538 1/20 0.37
POLB P06746 3/20 0.36
CYP2D6 P10635 1/20 0.36
MPL P40238 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3790419 0.84 CYP1A2 (0.50) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL10788346 0.82 CYP1A2 (0.45) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL28283934 0.81 GAA (0.46) TSHRSMN1; SMN2POLBMEN1KMT2A
SCHEMBL1808795 0.80 MYC (0.44) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL4826175 0.80 CYP1A2 (0.40) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL343357 0.80 MYC (0.44) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL8914222 0.80 CYP1A2 (0.40) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL2225465 0.80 CYP1A2 (0.40) MYCCYP1A2TSHRSMN1; SMN2TTR
SCHEMBL16712207 0.79 ALDH1A1 (0.35) TSHRSMN1; SMN2POLBMEN1KMT2A
SCHEMBL8744500 0.78 SUMO2 (0.43) MYCCYP1A2TSHRSMN1; SMN2TTR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1847568-B1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING-RESIN MOLDING MATERIAL, AND CURED OBJECT OBTAINED THEREFROM SUMITOMO BAKELITE CO (JP) 2015-05-20 EP disclosed
US-20140370403-A1 INEXPENSIVE METAL-FREE ORGANIC REDOX FLOW BATTERY (ORBAT) FOR GRID-SCALE STORAGE U.S. DEPARTMENT OF ENERGY 2014-12-18 US disclosed
CN-101065445-B Thermosetting resin composition, thermosetting-resin molding material, and cured object obtained therefrom SUMITOMO BAKELITE CO 2011-05-11 CN disclosed
US-7541410-B2 Thermosetting resin composition, thermosetting resin molding compound and cured product thereof SUMITOMO BAKELITE CO., LTD. (JP) 2009-06-02 US disclosed
US-20080139757-A1 Thermosetting Resin Composition, Thermosetting Resin Molding Compound And Cured Product Thereof SUMITOMO BAKELITE CO., LTD. (JP) 2008-06-12 US disclosed
CN-101065445-A Thermosetting resin composition, thermosetting-resin molding material, and cured object obtained therefrom SUMITOMO BAKELITE CO (JP) 2007-10-31 CN disclosed
EP-1847568-A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING-RESIN MOLDING MATERIAL, AND CURED OBJECT OBTAINED THEREFROM Sumitomo Bakelite Company, Limited (JP) 2007-10-24 EP disclosed
WO-2006094120-A2 TREATMENT FOR EMBOLIC STROKE THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2006-09-08 WO disclosed
US-6783913-B2 POLYMERIC ACETAL RESIN CONTAINS UNITS (A), (B), (C), (D), AND (E). UNIT (A) IS A VINYL ALCOHOL UNIT. UNIT; (B) IS A POLYVINYL ACETAL UNIT CONTAINING AN R GROUP, WHERE R IS HYDROGEN, AN ALIPHATIC GROUP, AN AROMATIC GROUP, OR AN KODAK POLYCHROME GRAPHICS LLC 2004-08-31 US disclosed
US-20030198887-A1 Polymeric acetal resins containing free radical inhibitors and their use in lithographic printing EASTMAN KODAK COMPANY 2003-10-23 US disclosed
EP-1350801-A1 Polymeric acetal resins containing free radical inhibitors and their use in lithographic printing Kodak Polychrome Graphics GmbH (DE) 2003-10-08 EP disclosed
US-4044151-A Sulfamidophenethanolamine therapeutic process MEAD JOHNSON & COMPANY (US) 1977-08-23 US disclosed