Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.88 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.88 |
| ▸ | CA5A | P35218 | 1/20 | 0.46 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL29908 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL2207803 | 1.00 | MEN1 (0.88) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL7562590 | 1.00 | MEN1 (0.88) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL6654677 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL246569 | 1.00 | MEN1 (0.88) | MEN1KMT2ACA5ACA5BTSHR | |
| Water SCHEMBL5330988 | 0.94 | — | — | |
| Water SCHEMBL3229367 | 0.94 | MEN1 (0.78) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL31326126 | 0.94 | — | — | |
| Water SCHEMBL31366015 | 0.94 | — | — | |
| Water SCHEMBL28983695 | 0.94 | MEN1 (0.78) | MEN1KMT2ACA5ACA5BTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7592266-B2 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2009-09-22 | — | — | US | claimed |
| US-20080066779-A1 | REMOVING SOLUTION, CLEANING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE | NEC ELECTRONICS CORPORATION (JP) | 2008-03-20 | — | — | US | claimed |
| US-7312160-B2 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2007-12-25 | — | — | US | claimed |
| US-7101517-B2 | Processing solution preparation and supply method and apparatus | NAGASE & CO., LTD. (JP) | 2006-09-05 | — | — | US | claimed |
| US-20030136763-A1 | Processing solution preparation and supply method and apparatus | NAGASE & CO., LTD. (JP) | 2003-07-24 | — | — | US | claimed |
| US-20030139045-A1 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2003-07-24 | — | — | US | claimed |
| JP-60175032-A | — | — | None | — | — | JP | disclosed |
| JP-62128529-A | — | — | None | — | — | JP | disclosed |
| JP-58182231-A | — | — | None | — | — | JP | disclosed |
| JP-61267054-A | — | — | None | — | — | JP | disclosed |
| US-20250368860-A1 | POLISHING AGENT, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND ADDITIVE SOLUTION FOR POLISHING AGENT | AGC Inc. (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20240360338-A1 | POLISHING AGENT, LIQUID ADDITIVE FOR POLISHING AGENT, AND POLISHING METHOD | AGC Inc. (JP) | 2024-10-31 | — | — | US | disclosed |
| WO-2023162832-A1 | METHOD FOR PRODUCING METAL OXIDE NANO-PARTICLES, AND METAL OXIDE NANO-PARTICLES | 株式会社スーパーナノデザイン | 2023-08-31 | — | — | WO | disclosed |
| EP-0694804-A2 | Liquid crystal display apparatus, semiconductor devices, and manufacturing methods therefor | HITACHI, LTD. (JP) | 1996-01-31 | — | — | EP | disclosed |
| JP-S62128529-A | FORMATION OF PATTERN | HOYA CORP | 1987-06-10 | — | — | JP | disclosed |
| JP-S61267054-A | ETCHING METHOD FOR PHOTOMASK BLANK | ARUBATSUKU SEIMAKU KK | 1986-11-26 | — | — | JP | disclosed |
| JP-S60175032-A | MANUFACTURE OF THIN FILM TRANSISTOR | SANYO ELECTRIC CO LTD | 1985-09-09 | — | — | JP | disclosed |
| US-4417025-A | Resin composition emulsion | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1983-11-22 | — | — | US | disclosed |
| JP-S58182231-A | PREPARATION OF MASK SUBSTRATE | OKI ELECTRIC IND CO LTD | 1983-10-25 | — | — | JP | disclosed |
| US-4243506-A | Plasma-etching apparatus | HITACHI, LTD. (JP) | 1981-01-06 | — | — | US | disclosed |