SCHEMBL3873607

SCHEMBL3873607

CCCC1=CCC(=O)C=C1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
GSK3A P49840 1/20 0.31
GSK3B P49841 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL2496371 0.92 PTPN1 (0.32)
Terephthalic Acid SCHEMBL9052449 0.85 RARB (0.41)
SCHEMBL3881256 0.82
SCHEMBL5941211 0.78 GSK3A (0.31) GSK3AGSK3B
SCHEMBL2133958 0.78 GSK3A (0.31) GSK3AGSK3B
SCHEMBL9719969 0.78 DAO (0.33)
SCHEMBL2772489 0.77 GSK3A (0.36) GSK3AGSK3B
SCHEMBL7696701 0.76 ALDH1A1 (0.37) GSK3AGSK3B
SCHEMBL5966287 0.75
SCHEMBL9219918 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112739755-B Expanded particles and expanded molded article 积水化成品工业株式会社 2023-02-17 CN disclosed
CN-112739755-A Expanded particles and expanded molded article 积水化成品工业株式会社 2021-04-30 CN disclosed
WO-2020195118-A1 RESIN COMPOSITION FOR PRODUCTION OF FOAM PARTICLES, FOAM PARTICLES, FOAM MOLDED BODY AND COMPOSITE STRUCTURE MEMBER 積水化成品工業株式会社 2020-10-01 WO disclosed
WO-2020065485-A1 EXPANDED PARTICLES AND EXPANDED MOLDED ARTICLE 積水化成品工業株式会社 2020-04-02 WO disclosed
CN-110785460-A Bead foam, resin composite provided with same, and method for producing bead foam 积水化成品工业株式会社 2020-02-11 CN disclosed
WO-2019189635-A1 EXPANDED BEADS, MOLDED FOAM, FIBER-REINFORCED COMPOSITE, AND AUTOMOTIVE COMPONENT 積水化成品工業株式会社 2019-10-03 WO disclosed
EP-2040101-A1 BASE FILM FOR PROTECTIVE FILM AND PROTECTIVE FILM COVERED POLARIZING PLATE Toyo Kohan Co., Ltd. (JP) 2009-03-25 EP disclosed
EP-0871568-A4 CONDUCTIVE FILM COMPOSITE DEXTER CORP (US) 2002-05-08 EP disclosed
EP-0702344-B1 Label continuum and producing method thereof PETTER CO LTD (JP) 2002-02-06 EP disclosed
WO-2000042452-A1 LIGHT REFLECTOR JSP CORPORATION (JP) 2000-07-20 WO disclosed
WO-1996041509-A1 METHOD FOR MAKING A DEBOSSED CONDUCTIVE FILM COMPOSITE THE DEXTER CORPORATION (US) 1996-12-19 WO disclosed
WO-1996040507-A1 CONDUCTIVE FILM COMPOSITE THE DEXTER CORPORATION (US) 1996-12-19 WO disclosed
WO-1996041508-A1 METHOD FOR MAKING A CONDUCTIVE FILM COMPOSITE THE DEXTER CORPORATION (US) 1996-12-19 WO disclosed
WO-1996040509-A1 DEBOSSABLE FILMS THE DEXTER CORPORATION (US) 1996-12-19 WO disclosed
EP-0703556-A1 Label continuum and producing method thereof PETTER CO., LTD. (JP) 1996-03-27 EP disclosed
EP-0702344-A1 Label continuum and producing method thereof PETTER CO., LTD. (JP) 1996-03-20 EP disclosed
EP-0599993-A1 A HARD COPY IMAGING SYSTEM. EASTMAN KODAK CO (US) 1994-06-08 EP disclosed
WO-1993003927-A1 A HARD COPY IMAGING SYSTEM EASTMAN KODAK COMPANY (US) 1993-03-04 WO disclosed
US-4855280-A INORGANIC DYE ABSORBER, POLYOLEFIN GOYO PAPER WORKING CO. LTD. (JP) 1989-08-08 US disclosed
EP-0275326-A1 COLOR DEVELOPER SHEET GOYO PAPER WORKING CO. LTD. (JP) 1988-07-27 EP disclosed