⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL35827 | 0.87 | — | — | |
| SCHEMBL6735807 | 0.75 | — | — | |
| SCHEMBL30915510 | 0.75 | — | — | |
| SCHEMBL917722 | 0.75 | — | — | |
| SCHEMBL5468017 | 0.75 | — | — | |
| SCHEMBL8773616 | 0.75 | — | — | |
| SCHEMBL31356287 | 0.75 | — | — | |
| Lithium SCHEMBL31251930 | 0.67 | — | — | |
| SCHEMBL30674922 | 0.58 | — | — | |
| SCHEMBL230103 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210242389-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | DEEB, ANTOINE E. | 2021-08-05 | — | — | US | disclosed |
| US-20210210670-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | DEEB, ANTOINE E. | 2021-07-08 | — | — | US | disclosed |
| US-20200388743-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | DEEB, ANTOINE E. | 2020-12-10 | — | — | US | disclosed |
| US-20200343433-A1 | THERMOELECTRIC DEVICES AND SYSTEMS | DEEB, ANTOINE E. | 2020-10-29 | — | — | US | disclosed |
| EP-3713480-A1 | THERMOELECTRIC DEVICES AND SYSTEMS | Matrix Industries, Inc. (US) | 2020-09-30 | — | — | EP | disclosed |
| CN-111655124-A | Thermoelectric device and system | 美特瑞克斯实业公司 | 2020-09-11 | — | — | CN | disclosed |
| US-10749094-B2 | Thermoelectric devices, systems and methods | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2020-08-18 | — | — | US | disclosed |
| US-20200259062-A1 | THERMOELECTRIC DEVICES AND SYSTEMS | DEEB, ANTOINE E. | 2020-08-13 | — | — | US | disclosed |
| US-20200217565-A1 | THERMOELECTRIC COOLING DEVICES, SYSTEMS AND METHODS | DEEB, ANTOINE E. | 2020-07-09 | — | — | US | disclosed |
| US-10644216-B2 | Methods and devices for forming thermoelectric elements | MATRIX INDUSTRIES, INC. (US) | 2020-05-05 | — | — | US | disclosed |
| US-20150280099-A1 | THERMOELECTRIC DEVICES AND SYSTEMS | DEEB, ANTOINE E. | 2015-10-01 | — | — | US | disclosed |
| US-20150228883-A1 | Systems and Methods for Forming Thermoelectric Devices | DEEB, ANTOINE E. | 2015-08-13 | — | — | US | disclosed |
| EP-2885823-A1 | SYSTEMS AND METHODS FOR FORMING THERMOELECTRIC DEVICES | Silicium Energy, Inc. (US) | 2015-06-24 | — | — | EP | disclosed |
| WO-2014070795-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | SILICIUM ENERGY, INC. (US) | 2014-05-08 | — | — | WO | disclosed |
| WO-2014028903-A1 | SYSTEMS AND METHODS FOR FORMING THERMOELECTRIC DEVICES | SILICIUM ENERGY, INC. (US) | 2014-02-20 | — | — | WO | disclosed |
| WO-2013012842-A1 | THERMOELECTRIC DEVICES, SYSTEMS AND METHODS | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2013-01-24 | — | — | WO | disclosed |
| US-20130019918-A1 | THERMOELECTRIC DEVICES, SYSTEMS AND METHODS | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2013-01-24 | — | — | US | disclosed |
| US-7560361-B2 | Method of forming gate stack for semiconductor electronic device | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-14 | — | — | US | disclosed |
| US-20060035450-A1 | Semiconductor-dielectric-semiconductor device structure fabricated by wafer bonding | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-02-16 | — | — | US | disclosed |
| US-5846609-A | Masking methods for semiconductor materials | MOTOROLA, INC. (US) | 1998-12-08 | — | — | US | disclosed |