Methacrylic Acid

Methacrylic Acid

SCHEMBL390016

C=C(C)C(=O)O.C=C(C=Cc1ccccc1)C(=O)OCCCC

nearest known ligand 0.49

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Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.49
TDP1 Q9NUW8 4/20 0.47
TSHR P16473 4/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
BCHE P06276 5/20 0.45
EGFR P00533 1/20 0.44
HDAC3 O15379 1/20 0.44
ACHE P22303 3/20 0.44
GLA P06280 1/20 0.43
APP P05067 1/20 0.42
ALDH1A1 P00352 1/20 0.42
CYP3A4 P08684 1/20 0.42
MAPK1 P28482 1/20 0.42
RAB9A P51151 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29394 0.95 KDM4E (0.53) KDM4ETDP1TSHRL3MBTL1BCHE
Methacrylic Acid SCHEMBL15376306 0.93 KDM4E (0.44) KDM4ETDP1TSHRL3MBTL1BCHE
SCHEMBL10941999 0.93 TDP1 (0.48) KDM4ETDP1TSHRL3MBTL1BCHE
SCHEMBL10940584 0.91 TDP1 (0.47) KDM4ETDP1TSHRL3MBTL1BCHE
SCHEMBL464928 0.91 TDP1 (0.50) KDM4ETDP1TSHRL3MBTL1BCHE
Maleic Acid SCHEMBL11028703 0.91 KDM4E (0.50) KDM4ETDP1TSHRL3MBTL1BCHE
Butadiene SCHEMBL10718191 0.91 KDM4E (0.50) KDM4ETDP1TSHRL3MBTL1BCHE
SCHEMBL10771896 0.90 TDP1 (0.46) KDM4ETDP1TSHRL3MBTL1BCHE
SCHEMBL6826960 0.90 KDM4E (0.47) KDM4ETDP1TSHRL3MBTL1BCHE
Styrene SCHEMBL522764 0.90 KDM4E (0.49) KDM4ETDP1TSHRL3MBTL1BCHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8101339-B2 Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-01-24 US disclosed
CN-101988922-A Detecting method and dielectric particle containing magnetic material employed in the detecting method FUJIFILM CORP 2011-03-23 CN disclosed
US-20090317746-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-12-24 US disclosed
CN-1817981-A Nanometer painting ink-jetting printing oil ink and production thereof UNIV ZHEJIANG (CN) 2006-08-16 CN disclosed
US-5977228-A Plasticized aqueous coating compositions S. C. JOHNSON COMMERCIAL MARKETS, INC. (US) 1999-11-02 US disclosed
US-5225272-A Comprising a polymeric substrate having an adharent layer; packaging film IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1993-07-06 US disclosed
EP-0026932-B1 AQUEOUS EMULSION COMPRISING THE REACTION PRODUCTS OF A VINYL ACID MONOMER AND A SECOND COPOLYMERISABLE MONOMER GAF CORPORATION (US) 1986-01-15 EP disclosed