Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | SPHK1 | Q9NYA1 | 7/20 | 0.36 |
| ▸ | SPHK2 | Q9NRA0 | 6/20 | 0.36 |
| ▸ | TSHR | P16473 | 3/20 | 0.36 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | THRB | P10828 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | FASN | P49327 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7724603 | 0.98 | ALDH1A1 (0.41) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL7113556 | 0.93 | — | — | |
| SCHEMBL51206 | 0.87 | ALDH1A1 (0.46) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL11428775 | 0.86 | TSHR (0.48) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL8855829 | 0.85 | ALDH1A1 (0.50) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL8727383 | 0.85 | ALDH1A1 (0.50) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL8855730 | 0.85 | ALDH1A1 (0.50) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL5685367 | 0.85 | ALDH1A1 (0.50) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL11809342 | 0.85 | ALDH1A1 (0.50) | ALDH1A1SPHK1SPHK2TSHREPHX1 | |
| SCHEMBL8855705 | 0.85 | ALDH1A1 (0.50) | ALDH1A1SPHK1SPHK2TSHREPHX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090255629-A1 | Fluid ejection device utilizing a one-part epoxy adhesive | GIBSON LAWRENCE E | 2009-10-15 | — | — | US | disclosed |
| US-7581828-B2 | Fluid ejection cartridge utilizing a two-part epoxy adhesive | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2009-09-01 | — | — | US | disclosed |
| US-7566122-B2 | Fluid ejection device utilizing a one-part epoxy adhesive | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2009-07-28 | — | — | US | disclosed |
| US-20060204690-A1 | Fluid Ejection Cartridge Utilizing A Two-Part Epoxy Adhesive | GIBSON LAWRENCE E | 2006-09-14 | — | — | US | disclosed |
| US-7063413-B2 | Fluid ejection cartridge utilizing a two-part epoxy adhesive | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2006-06-20 | — | — | US | disclosed |
| US-20050231551-A1 | Fluid ejection device utilizing a one-part epoxy adhesive | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2005-10-20 | — | — | US | disclosed |
| US-20050019510-A1 | Fluid ejection cartridge utilizing a two-part epoxy adhesive | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2005-01-27 | — | — | US | disclosed |
| US-6337375-B1 | RESIN WITH COLOR AND FLUORESCING AGENT | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-01-08 | — | — | US | disclosed |
| US-6190759-B1 | ELECTRONIC PACKAGE COMPRISING DIELECTRIC LAYER AND CONDUCTIVE LAYER, SAID DIELECTRIC LAYER INCLUDING REINFORCING MATERIAL, RESIN MATERIAL SELECTED FROM EPOXY, CYANATE AND BISMALEIMIDE RESINS, COLORING AGENT, AND FLUORESCING AGENT | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-02-20 | — | — | US | disclosed |
| US-6187417-B1 | Substrate having high optical contrast and method of making same | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-02-13 | — | — | US | disclosed |
| EP-0053280-A1 | Sealing composition, method for preparing said composition, integrated circuit module sealed therewith, and process for sealing | International Business Machines Corporation (US) | 1982-06-09 | — | — | EP | disclosed |
| EP-0009190-B1 | CURABLE COMPOSITION USEFUL FOR SCREEN-PRINTING, A CURED COATING COMPRISING SAID COMPOSITION AND PROCESS FOR SOLDERING PRINTED CIRCUIT BOARDS USING SAID COMPOSITION | International Business Machines Corporation (US) | 1982-04-28 | — | — | EP | disclosed |
| US-4293457-A | POLYESTER; AMINOPLAST CURING AGENT; THERMOPLASTIC ACRYLIC POLYMER; CELLULOSE ACETATE BUTYRATE, EPOXY RESIN, OR VINYL ESTER-VINYL HALIDE COPOLYMER | PPG INDUSTRIES, INC. (US) | 1981-10-06 | — | — | US | disclosed |
| US-4292230-A | Screen-printing composition and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1981-09-29 | — | — | US | disclosed |
| US-4246147-A | Screenable and strippable solder mask and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1981-01-20 | — | — | US | disclosed |
| EP-0019802-A2 | Soldering mask composition to be processed by a screen printing process and subsequently removed and process for producing a removable soldering mask | International Business Machines Corporation (US) | 1980-12-10 | — | — | EP | disclosed |
| US-4237216-A | Photosensitive patternable coating composition containing novolak type materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1980-12-02 | — | — | US | disclosed |
| US-4232090-A | Sealerless primers | PPG INDUSTRIES, INC. (US) | 1980-11-04 | — | — | US | disclosed |
| EP-0009190-A1 | Curable composition useful for screen-printing, a cured coating comprising said composition and process for soldering printed circuit boards using said composition | International Business Machines Corporation (US) | 1980-04-02 | — | — | EP | disclosed |
| US-4187258-A | AMINOPLAST CURING AGENT; POLYESTER, POLYETHER, OR POLYURETHANE, THERMOPLASTIC ACRYLIC RESIN | PPG INDUSTRIES, INC. (US) | 1980-02-05 | — | — | US | disclosed |