⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2370591 | 0.77 | — | — | |
| Tert-Butylamine SCHEMBL27972364 | 0.74 | — | — | |
| SCHEMBL8924714 | 0.74 | MEN1 (0.35) | — | |
| SCHEMBL21473976 | 0.74 | MEN1 (0.30) | — | |
| SCHEMBL27876759 | 0.74 | MEN1 (0.30) | — | |
| SCHEMBL2496092 | 0.72 | — | — | |
| SCHEMBL27752639 | 0.72 | — | — | |
| SCHEMBL10891865 | 0.71 | — | — | |
| SCHEMBL21468437 | 0.71 | — | — | |
| SCHEMBL198740 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 174 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12298669-B2 | Composition comprising three alkanolamines and a hydroxylamine for removing etch residues | VERSUM MATERIALS US, LLC (US) | 2025-05-13 | — | — | US | claimed |
| CN-114450388-B | Composition for removing etching residues, and use method and application thereof | 弗萨姆材料美国有限责任公司 | 2025-03-21 | — | — | CN | claimed |
| US-20220380705-A1 | Composition For Removing Etch Residues, Methods Of Using And Use Thereof | VERSUM MATERIALS US, LLC (US) | 2022-12-01 | — | — | US | claimed |
| EP-4034629-A1 | COMPOSITIONS FOR REMOVING ETCH RESIDUES, METHODS OF USING AND USE THEREOF | Versum Materials US, LLC (US) | 2022-08-03 | — | — | EP | claimed |
| CN-113589662-B | Composition, stripping liquid, application of stripping liquid in stripping of photoresist or photoresist residues and stripping method | 浙江奥首材料科技有限公司 | 2022-07-12 | — | — | CN | claimed |
| EP-3999621-A1 | COMPOSITIONS FOR REMOVING ETCH RESIDUES, METHODS OF USING AND USE THEREOF | Versum Materials US, LLC (US) | 2022-05-25 | — | — | EP | claimed |
| CN-114450388-A | Composition for removing etching residues, and use method and application thereof | 弗萨姆材料美国有限责任公司 | 2022-05-06 | — | — | CN | claimed |
| CN-114127230-A | Composition for removing etching residues, method for using same and use thereof | 弗萨姆材料美国有限责任公司 | 2022-03-01 | — | — | CN | claimed |
| CN-113589662-A | Composition, stripping liquid, application of stripping liquid in stripping of photoresist or photoresist residues and stripping method | 浙江奥首材料科技有限公司 | 2021-11-02 | — | — | CN | claimed |
| WO-2021061922-A1 | COMPOSITIONS FOR REMOVING ETCH RESIDUES, METHODS OF USING AND USE THEREOF | VERSUM MATERIALS US, LLC (US) | 2021-04-01 | — | — | WO | claimed |
| US-20040106530-A1 | Inhibition of titanium corrosion | DAVIOT JEROME (GB) | 2004-06-03 | — | — | US | claimed |
| EP-1273033-A1 | INHIBITION OF TITANIUM CORROSION | EKC Technology, Ltd (GB) | 2003-01-08 | — | — | EP | claimed |
| US-6492311-B2 | REMOVING PHOTORESIST RESIDUE; DOES NOT CORRODE OR ATTACK TITANIUM OR OTHER METALLURGY, OXIDE OR NITRIDE LAYERS ON THE SUBSTRATE | EKC TECHNOLOGY, INC. | 2002-12-10 | — | — | US | claimed |
| US-6480371-B1 | Alkanolamine-phosphoric acid anodizing electrolyte | KEMET ELECTRONICS CORPORATION | 2002-11-12 | — | — | US | claimed |
| US-6367486-B1 | REMOVES PHOTORESIST AND OTHER RESIDUE FROM INTEGRATED CIRCUIT SUBSTRATES. | EKC TECHNOLOGY, INC. | 2002-04-09 | — | — | US | claimed |
| WO-2001078129-A1 | INHIBITION OF TITANIUM CORROSION | EKC TECHNOLOGY, LTD. (GB) | 2001-10-18 | — | — | WO | claimed |
| WO-2001057292-A1 | ALKANOLAMINE-PHOSPHORIC ACID ANODIZING ELECTROLYTE | KEMET ELECTRONICS CORPORATION (US) | 2001-08-09 | — | — | WO | claimed |
| US-6221818-B1 | Hydroxylamine-gallic compound composition and process | EKC TECHNOLOGY, INC. | 2001-04-24 | — | — | US | claimed |
| US-6187730-B1 | REMOVING PHOTORESIST OR OTHER POLYMERIC MATERIAL OR A RESIDUE FROM A SUBSTRATE, SUCH AS AN INTEGRATED CIRCUIT SEMICONDUCTOR WAFER INCLUDING TITANIUM METALLURGY | EKC TECHNOLOGY, INC. | 2001-02-13 | — | — | US | claimed |
| WO-2000022662-A1 | INHIBITION OF TITANIUM CORROSION | EKC TECHNOLOGY, LTD (GB) | 2000-04-20 | — | — | WO | claimed |