⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15808492 | 1.00 | — | — | |
| SCHEMBL19398878 | 0.85 | — | — | |
| SCHEMBL4578843 | 0.80 | — | — | |
| Monoethanolamine SCHEMBL9006736 | 0.78 | TSHR (0.40) | — | |
| SCHEMBL19398879 | 0.78 | TDP1 (0.33) | — | |
| SCHEMBL15264553 | 0.78 | TSHR (0.37) | — | |
| SCHEMBL332590 | 0.78 | — | — | |
| SCHEMBL21904372 | 0.78 | — | — | |
| SCHEMBL332589 | 0.78 | — | — | |
| SCHEMBL5611466 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260028529-A1 | ETCHING COMPOSITIONS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2026-01-29 | — | — | US | claimed |
| US-20250101303-A1 | ETCHING COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2025-03-27 | — | — | US | claimed |
| WO-2025064522-A1 | ETCHING COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-03-27 | — | — | WO | claimed |
| CN-109196142-B | Method for the clean preparation of ferrous parts joined by welding | 汉高股份有限及两合公司 | 2022-09-20 | — | — | CN | claimed |
| US-11408080-B2 | Method of cleaning pretreatment of ferrous components that have been joined by welding | HENKEL AG & CO. KGAA (DE) | 2022-08-09 | — | — | US | claimed |
| US-11377624-B2 | Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process | BASF SE (DE) | 2022-07-05 | — | — | US | claimed |
| US-20210301221-A1 | CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS | BASF SE (DE) | 2021-09-30 | — | — | US | claimed |
| WO-2021052269-A1 | WATER-SOLUBLE COMPOSITION, PREPARATION METHOD AND APPLICATION THEREOF | 广东省禾基生物科技有限公司 | 2021-03-25 | — | — | WO | claimed |
| EP-3720938-A1 | CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS | BASF SE (DE) | 2020-10-14 | — | — | EP | claimed |
| CN-111465679-A | Cleaning compositions for removing post-etch or post-ash residues from semiconductor substrates and corresponding methods | 巴斯夫欧洲公司 | 2020-07-28 | — | — | CN | claimed |
| WO-2009070190-A1 | PRINTER HEAD AND PRINTER DISK CLEANING COMPOSITIONS AND METHODS OF USE | EKC TECHNOLOGY, INC. (US) | 2009-06-04 | — | — | WO | claimed |
| US-20090137439-A1 | Printer Head and Printer Disk Cleaning Compositions and Methods of Use | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | claimed |
| US-7045655-B2 | Preparation and purification of hydroxylamine stabilizers | BASF AKTIENGESELLSCHAFT (DE) | 2006-05-16 | — | — | US | claimed |
| US-20050131250-A1 | Preparation and purification of hydroxylamine stabilizers | BASF AKTIENGESELLSCHAFT (DE) | 2005-06-16 | — | — | US | claimed |
| US-20050107467-A1 | Methods for producing and using a Cu(I)-based wood preservative | OSMOSE, INC | 2005-05-19 | — | — | US | claimed |
| WO-2005037507-A1 | METHODS FOR PRODUCING AND USING A CU(1)-BASED WOOD PRESERVATIVE | PHIBRO-TECH, INC. (US) | 2005-04-28 | — | — | WO | claimed |
| US-6867327-B2 | Preparation and purification of hydroxylamine stabilizers | BASF AKTIENGESELLSCHAFT (DE) | 2005-03-15 | — | — | US | claimed |
| EP-1431276-A1 | Preparation and purification of hydroxylamine stabilizers | BASF AKTIENGESELLSCHAFT (DE) | 2004-06-23 | — | — | EP | claimed |
| US-20040116735-A1 | Preparation and purification of hydroxylamine stabilizers | BASF AKTIENGESELLSCHAFT (DE) | 2004-06-17 | — | — | US | claimed |
| EP-0723205-B1 | Removing agent composition and method of removing photoresist using the same | MITSUBISHI GAS CHEMICAL CO (JP) | 2002-05-08 | — | — | EP | claimed |