SCHEMBL394041

SCHEMBL394041

CCCCCCCCCCCCCOC(=O)C=CC(=O)OCCCCCCCCCCCCC.CCCC[Sn]CCCC

nearest known ligand 0.69

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 4/20 0.69
ATM Q13315 1/20 0.66
MAPT P10636 1/20 0.50
RAB9A P51151 1/20 0.50
NPSR1 Q6W5P4 1/20 0.50
NAAA Q02083 1/20 0.48
APP P05067 4/20 0.48
TSHR P16473 2/20 0.47
HPGD P15428 1/20 0.47
PRKCA P17252 2/20 0.47
HTT P42858 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
EPHX1 P07099 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1361701 1.00 HCAR2 (0.69) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL1361703 1.00 HCAR2 (0.69) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL394039 1.00 HCAR2 (0.69) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL5689031 1.00 HCAR2 (0.69) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL10859931 1.00 HCAR2 (0.69) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL10859921 1.00 HCAR2 (0.69) HCAR2ATMMAPTRAB9ANPSR1
Hexyl Fumarate SCHEMBL11599799 0.94 HCAR2 (0.81) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL6904516 0.94 HCAR2 (0.81) HCAR2ATMMAPTRAB9ANPSR1
Hexyl Fumarate SCHEMBL11599810 0.94 HCAR2 (0.81) HCAR2ATMMAPTRAB9ANPSR1
SCHEMBL27680539 0.94 HCAR2 (0.81) HCAR2ATMMAPTRAB9ANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025075042-A1 TWO-PACK TYPE CURABLE COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
US-20240228817-A9 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE KANEKA CORPORATION (JP) 2024-07-11 US disclosed
CN-118103451-A Multi-agent type curable composition and use thereof 株式会社钟化 2024-05-28 CN disclosed
EP-4368670-A1 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE Kaneka Corporation (JP) 2024-05-15 EP disclosed
US-20240132743-A1 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE KANEKA CORPORATION (JP) 2024-04-25 US disclosed
CN-114096590-B UV and/or thermally curable silicone-based materials and formulations 汉高股份有限及两合公司 2024-04-19 CN disclosed
CN-115698215-B Urethane adhesive composition SIKA技术股份公司 2024-02-13 CN disclosed
CN-115698215-A Urethane adhesive composition 西卡豪马泰特株式会社 2023-02-03 CN disclosed
US-20220372271-A1 COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, AND STORAGE METHOD KANEKA CORPORATION (JP) 2022-11-24 US disclosed
CN-114096590-A UV and/or thermally curable silicone-based materials and formulations 汉高知识产权控股有限责任公司 2022-02-25 CN disclosed
US-20090170995-A1 Curable Resin Composition KANEKA CORPORATION (JP) 2009-07-02 US disclosed
EP-2072577-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2009-06-24 EP disclosed
EP-2011833-A1 CURABLE RESIN COMPOSITION Kaneka Corporation (JP) 2009-01-07 EP disclosed
US-20070161768-A1 Method for producing hydrolyzable silicon group-containing oxyalkylene polymer and curing composition thereof KANEKA CORPORATION (JP) 2007-07-12 US disclosed
EP-1710270-A1 METHOD FOR PRODUCING HYDROLYZABLE SILICON GROUP-CONTAINING OXYALKYLENE POLYMER AND CURING COMPOSITION THEREOF Kaneka Medix Corporation (JP) 2006-10-11 EP disclosed
US-20060205887-A1 Polymer and curable compositions improved in storage stability KANEKA CORPORATION (JP) 2006-09-14 US disclosed
US-20060173121-A1 Curable composition KANEKA CORPORATION (JP) 2006-08-03 US disclosed
EP-1650261-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-04-26 EP disclosed
EP-1586605-A1 POLYMER AND CURABLE COMPOSITIONS IMPROVED IN STORAGE STABILITY KANEKA CORPORATION (JP) 2005-10-19 EP disclosed
CN-1392890-A Curable composition and use thereof MITSUI CHEMICALS INC (JP) 2003-01-22 CN disclosed