SCHEMBL394136

SCHEMBL394136

Cc1c(O)ccc(CO)c1CO

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TYR P14679 1/20 0.40
KDM4E B2RXH2 3/20 0.39
ALDH1A1 P00352 2/20 0.39
HPGD P15428 1/20 0.39
HSD17B10 Q99714 1/20 0.39
KLF10 Q13118 1/20 0.39
PKM P14618 1/20 0.38
LMNA P02545 2/20 0.37
NPC1 O15118 1/20 0.37
GAA P10253 1/20 0.37
HTT P42858 1/20 0.37
RAB9A P51151 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
PDCD1 Q15116 2/20 0.35
CD274 Q9NZQ7 2/20 0.35
TRPA1 O75762 1/20 0.34
ATM Q13315 1/20 0.34
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31302207 1.00 TYR (0.40) TYRKDM4EALDH1A1HPGDHSD17B10
SCHEMBL428824 0.82 KDM4E (0.39) TYRKDM4EALDH1A1HPGDHSD17B10
SCHEMBL3468895 0.81 TYR (0.42) TYRKDM4EALDH1A1HPGDHSD17B10
SCHEMBL29624183 0.79 PDCD1 (0.36) KDM4EALDH1A1HPGDHSD17B10SMN1; SMN2
SCHEMBL205613 0.79 PDCD1 (0.36) KDM4EALDH1A1HPGDHSD17B10SMN1; SMN2
SCHEMBL28845277 0.79 TYR (0.55) TYRKDM4EALDH1A1HPGDHSD17B10
SCHEMBL207165 0.78 KDM4E (0.41) TYRKDM4EALDH1A1HPGDHSD17B10
SCHEMBL31394482 0.76 PDCD1 (0.34) KDM4EALDH1A1HPGDHSD17B10PDCD1
SCHEMBL31098402 0.76 KDM4E (0.36) TYRKDM4EALDH1A1HPGDHSD17B10
SCHEMBL286284 0.76 KDM4E (0.36) TYRKDM4EALDH1A1HPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 288 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0273026-A2 Solvents for Photoresist compositions SHIPLEY COMPANY INC. (US) 1988-06-29 EP claimed
JP-9136850-A None JP disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
EP-4398289-B1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID FUJIFILM CORP (JP) 2025-07-02 EP disclosed
WO-2025094716-A1 RESIN COMPOSITION 富士フイルム株式会社 2025-05-08 WO disclosed
US-5128230-A Positive working photoresist SHIPLEY COMPANY INC. (US) 1992-07-07 US disclosed
US-5051454-A An esterified phenolic compound, an unesterified phenolic resole and a base and curing BORDEN, INC. (US) 1991-09-24 US disclosed
US-4983492-A Positive dye photoresist compositions with 2,4-bis(phenylazo)resorcinol SHIPLEY COMPANY INC. (US) 1991-01-08 US disclosed
EP-0377996-A1 Phenolic resins BORDEN (UK) LIMITED (GB) 1990-07-18 EP disclosed
EP-0377308-A1 Phenolic resins BORDEN (UK) LIMITED (GB) 1990-07-11 EP disclosed
WO-1990006903-A1 PHENOLIC RESINS BORDEN (UK) LIMITED (GB) 1990-06-28 WO disclosed
WO-1990006904-A2 PHENOLIC RESINS BORDEN (UK) LIMITED (GB) 1990-06-28 WO disclosed
EP-0345714-A2 Dyed photoresist compositions and process ASPECT SYSTEMS CORPORATION (US) 1989-12-13 EP disclosed
EP-0273026-A2 Solvents for Photoresist compositions SHIPLEY COMPANY INC. (US) 1988-06-29 EP disclosed
US-4469516-A Pigment preparations; process for their manufacture and their use HOECHST AKTIENGESELLSCHAFT (DE) 1984-09-04 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 TYR 4050/4885KDM4E 295/4885ALDH1A1 3316/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.