SCHEMBL3943091

SCHEMBL3943091

Nc1cc(N)cc(Oc2cccc(C(=O)O)c2)c1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.71
KMO O15229 1/20 0.59
KDM4E B2RXH2 1/20 0.55
MAOB P27338 1/20 0.52
TNKS O95271 1/20 0.51
PARP15 Q460N3 1/20 0.51
PARP14 Q460N5 1/20 0.51
PARP10 Q53GL7 1/20 0.51
TNKS2 Q9H2K2 1/20 0.51
PARP2 Q9UGN5 1/20 0.51
MRGPRX4 Q96LA9 1/20 0.51
NPC1 O15118 1/20 0.51
POLB P06746 1/20 0.51
CYP2C9 P11712 1/20 0.51
RAB9A P51151 1/20 0.51
F2 P00734 1/20 0.50
F10 P00742 1/20 0.50
HDAC8 Q9BY41 1/20 0.50
LOXL2 Q9Y4K0 1/20 0.49
KMT2A Q03164 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6380428 0.91 AKR1C3 (0.73) AKR1C3KMOKDM4EMAOBTNKS
SCHEMBL30449599 0.87 AKR1C3 (0.92) AKR1C3KMOKDM4ETNKSPARP15
SCHEMBL68858 0.87 AKR1C3 (0.92) AKR1C3KMOKDM4ETNKSPARP15
SCHEMBL30307454 0.87 AKR1C3 (0.92) AKR1C3KMOKDM4ETNKSPARP15
SCHEMBL23005775 0.86 MAOB (0.61) AKR1C3KMOKDM4EMAOBTNKS
SCHEMBL619686 0.86 AKR1C3 (0.77) AKR1C3KMOKDM4EMAOBTNKS
SCHEMBL1635565 0.85 AKR1C3 (0.88) AKR1C3KMOKDM4ETNKSPARP15
SCHEMBL30266792 0.85 AKR1C3 (0.88) AKR1C3KMOKDM4ETNKSPARP15
M-Phenoxybenzoic Acid For Cis-Isomer SCHEMBL30445868 0.83 AKR1C3 (1.00) AKR1C3KMOKDM4ETNKSPARP15
SCHEMBL1042631 0.83 AKR1C3 (0.92) AKR1C3KMOKDM4ETNKSPARP15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed