SCHEMBL394934

SCHEMBL394934

CCC(O)=S.CCC(O)=S.CCC(O)=S.CCC(O)=S.OCC(CO)(CO)CO

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.33
TSHR P16473 2/20 0.33
FFAR3 O14843 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28369457 1.00 ALDH1A1 (0.33) ALDH1A1TSHRFFAR3
SCHEMBL27384901 1.00 ALDH1A1 (0.33) ALDH1A1TSHRFFAR3
SCHEMBL7037751 0.88 ALDH1A1 (0.30) ALDH1A1TSHR
SCHEMBL1793189 0.82
SCHEMBL11656044 0.80 FFAR3 (0.33) FFAR3
SCHEMBL1412288 0.80 FFAR3 (0.33) FFAR3
SCHEMBL447945 0.80 ALDH1A1 (0.37) ALDH1A1TSHR
SCHEMBL28366677 0.80 ALDH1A1 (0.37) ALDH1A1TSHR
Alcohol SCHEMBL11440751 0.79
Alcohol SCHEMBL30337289 0.79 ALDH1A1 (0.50) ALDH1A1TSHRFFAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 537 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3357945-B1 ADHESIVE POLYMER AND MEDICAL ADHESIVE PATCH TEIKOKU SEIYAKU KK (JP) 2024-10-30 EP claimed
US-11635692-B2 Resist underlying film forming composition NISSAN CHEMICAL CORPORATION (JP) 2023-04-25 US claimed
US-10647819-B2 Photocurable composition and optical material MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-05-12 US claimed
US-8779065-B2 Fluorine-containing curable resin, active energy beam-curable composition, and cured product thereof DIC CORPORATION (JP) 2014-07-15 US claimed
EP-1223190-B1 Room temperature curable organopolysiloxane composition for molding SHINETSU CHEMICAL CO (JP) 2011-10-12 EP claimed
US-20090236036-A1 HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PROCESS FOR CIRCUIT BOARD USING THE HEAT CURABLE COMPOSITION PANASONIC CORPORATION (JP) 2009-09-24 US claimed
EP-0986767-B1 OPTICAL LENS IN TRANSPARENT ORGANIC POLYMER MATERIAL WITH HIGH REFRACTIVE INDEX AND HIGH ABBE NUMBER ESSILOR INT (FR) 2002-09-18 EP claimed
US-6242149-B1 LIGHT SENSITIVE ELEMENTS CURED WITH RADIATION, RADICAL POLYMERIZATION, PHOTOPOLYMERIZATION, ENCAPSULATION BROTHER KOGYO KABUSHIKI KAISHA (JP) 2001-06-05 US claimed
US-5767212-A RADICALLY POLYMERIZING ACRYLATE MONOMER CONTAINING SULFUR TORAY INDUSTRIES, INC. (JP) 1998-06-16 US claimed
US-5679762-A CONTAINING POLYVALENT MERCAPTAN SEGMENT; HOT MELT ADHESIVES, PRESSURE SENSITIVE ADHESIVES NIPPON SHOKUBAI CO., LTD. (JP) 1997-10-21 US claimed
EP-0565891-A1 Copolymer latex, production and use thereof TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 1993-10-20 EP claimed
US-4698113-A Method of curing photocurable and heat-curable compositions and a method of adhering members to each other by using them MATSUSHITA ELECTRIC (JP) 1987-10-06 US claimed
EP-0054942-B1 ADHESIVES FOR BONDING OPTICAL ELEMENTS MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1986-03-05 EP claimed
US-4560457-A Adhesives for bonding optical elements MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1985-12-24 US claimed
EP-0054942-A1 Adhesives for bonding optical elements MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1982-06-30 EP claimed
JP-59078230-A None JP disclosed
EP-3753997-B1 LATENT ADDITIVE AND COMPOSITION CONTAINING LATENT ADDITIVE ADEKA CORP (JP) 2026-05-06 EP disclosed
US-4560457-A Adhesives for bonding optical elements MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1985-12-24 US disclosed
JP-S5978230-A ROOM TEMPERATURE-CURABLE EPOXY RESIN COMPOSITION YUKA SHELL EPOXY KK 1984-05-07 JP disclosed
EP-0054942-A1 Adhesives for bonding optical elements MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1982-06-30 EP disclosed