SCHEMBL395330

SCHEMBL395330

CCO[Si](CC)(OCC)C(C)N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL391192 0.82
SCHEMBL7156174 0.79
SCHEMBL394102 0.79
SCHEMBL2888670 0.79
SCHEMBL393687 0.78
SCHEMBL393629 0.78
SCHEMBL394077 0.76
SCHEMBL395201 0.73
SCHEMBL394490 0.72 OPRM1 (0.31)
SCHEMBL3683153 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8378037-B2 Moisture-curable silylated polyurea and adhesive, sealant and coating compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2013-02-19 US claimed
EP-2231740-B1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2011-08-24 EP claimed
EP-2231740-A1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME Momentive Performance Materials Inc. (US) 2010-09-29 EP claimed
WO-2009085285-A1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2009-07-09 WO claimed
US-20090171040-A1 Moisture-curable silylated polyurea and adhesive, sealant and coating compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. 2009-07-02 US claimed
EP-3615593-B1 SILANE MODIFIED POLYMERS WITH IMPROVED PROPERTIES HENKEL AG & CO KGAA (DE) 2024-05-15 EP disclosed
US-11692060-B2 Silane modified polymers with improved properties Henkel IP & Holding GmbH (DE) 2023-07-04 US disclosed
EP-3615593-A1 SILANE MODIFIED POLYMERS WITH IMPROVED PROPERTIES Henkel IP & Holding GmbH (DE) 2020-03-04 EP disclosed
US-20200055984-A1 Silane Modified Polymers With Improved Properties HENKEL AG & CO. KGAA (DE) 2020-02-20 US disclosed
WO-2018200796-A1 SILANE MODIFIED POLYMERS WITH IMPROVED PROPERTIES Henkel IP & Holding GmbH (DE) 2018-11-01 WO disclosed
EP-2089490-B2 PREPOLYMER MIXTURE CONTAINING SILYL GROUPS AND USE THEREOF HENKEL AG & CO KGAA (DE) 2017-01-04 EP disclosed
EP-2271691-B1 CURABLE COMPOSITIONS CONTAINING SILYLATED POLYETHER BLOCK POLYMER-BASED POLYURETHANES HENKEL AG & CO KGAA (DE) 2015-03-04 EP disclosed
EP-1678254-A1 POLYMERS WITH IMPROVED STRENGTH COMPRISING MIXED OXYALKYL UNITS Henkel Kommanditgesellschaft auf Aktien (DE) 2006-07-12 EP disclosed
EP-1668090-A1 COHESION-REDUCED BINDER PRODUCTION AND USE THEREOF IN DETACHABLE ASSEMBLY ADHESIVES Henkel Kommanditgesellschaft auf Aktien (DE) 2006-06-14 EP disclosed
WO-2005047394-A1 POLYMERS WITH IMPROVED STRENGTH COMPRISING MIXED OXYALKYL UNITS HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2005-05-26 WO disclosed
WO-2005042610-A2 STORAGE-STABLE POLYURETHANE COMPRISING SILYL GROUPS HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2005-05-12 WO disclosed
WO-2005033241-A1 COHESION-REDUCED BINDER PRODUCTION AND USE THEREOF IN DETACHABLE ASSEMBLY ADHESIVES HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2005-04-14 WO disclosed
US-6653043-B1 Mixtures of photoresists, sensitizers and active materials such as silica sol modified by resorcin coupled to silanes, used to improve sensitivity and resolution KANSAI RESEARCH INSTITUTE, INC. (JP) 2003-11-25 US disclosed
US-6534235-B1 Photosensitive resin and inorganic particles having a functional group obtained by a reaction between inorganic particles and a coupling agent KANSAI RESEARCH INSTITUTE, INC. (JP) 2003-03-18 US disclosed
EP-1096313-A1 Active particle, photosensitive resin composition, and process for forming pattern Kansai Research Institute, Inc. (JP) 2001-05-02 EP disclosed