⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acetoacetic Acid SCHEMBL4550600 | 0.97 | — | — | |
| Acetoacetic Acid SCHEMBL134196 | 0.97 | — | — | |
| Acetoacetic Acid SCHEMBL3970307 | 0.93 | — | — | |
| Acetoacetic Acid SCHEMBL28212134 | 0.93 | — | — | |
| Acetoacetic Acid SCHEMBL28972036 | 0.93 | LDHA (0.57) | — | |
| Acetoacetic Acid SCHEMBL31420005 | 0.93 | — | — | |
| Acetoacetic Acid SCHEMBL10941648 | 0.93 | LDHA (0.57) | — | |
| Acetoacetic Acid SCHEMBL21402364 | 0.93 | — | — | |
| Acetoacetic Acid SCHEMBL1144213 | 0.93 | LDHA (0.57) | — | |
| Acetoacetic Acid SCHEMBL649090 | 0.93 | LDHA (0.57) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1621534-B1 | Compositions containing oxetane compounds for use in semiconductor packaging | HENKEL AG & CO KGAA (DE) | 2012-12-19 | — | — | EP | disclosed |
| US-7632425-B1 | Composition and associated method | GENERAL ELECTRIC COMPANY (US) | 2009-12-15 | — | — | US | disclosed |
| US-20090302280-A1 | COMPOSITION AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2009-12-10 | — | — | US | disclosed |
| EP-2011789-A1 | Compositions containing oxetane compounds for use in semiconductor packaging | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2009-01-07 | — | — | EP | disclosed |
| WO-2008127282-A2 | COMPOSITION AND ASSOCIATED METHOD | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-10-23 | — | — | WO | disclosed |
| US-20080121845-A1 | Oxetane composition, associated method and article | GENERAL ELECTRIC COMPANY (US) | 2008-05-29 | — | — | US | disclosed |
| WO-2008045351-A2 | COMPOSITION AND ASSOCIATED METHOD | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-04-17 | — | — | WO | disclosed |
| US-20080085962-A1 | Silver nanoparticles; produced by reduction of carbamate salt; electrical and thermal conductive adhesives | GENERAL ELECTRIC COMPANY (US) | 2008-04-10 | — | — | US | disclosed |
| US-20080083299-A1 | COMPOSITION AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2008-04-10 | — | — | US | disclosed |
| US-20080085410-A1 | COMPOSITION AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2008-04-10 | — | — | US | disclosed |
| WO-2008021135-A2 | SYNERETIC COMPOSITION, ASSOCIATED METHOD AND ARTICLE | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-02-21 | — | — | WO | disclosed |
| WO-2008019152-A1 | COMPOSITION, ASSOCIATED METHOD AND ARTICLE | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-02-14 | — | — | WO | disclosed |
| US-20080039608-A1 | Oxetane composition, associated method and article | GENERAL ELECTRIC COMPANY (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080039560-A1 | Syneretic composition, associated method and article | GENERAL ELECTRIC COMPANY (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080039542-A1 | Composition and associated method | GENERAL ELECTRIC COMPANY (US) | 2008-02-14 | — | — | US | disclosed |
| WO-2008019149-A1 | COMPOSITION AND ASSOCIATED METHOD | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-02-14 | — | — | WO | disclosed |
| WO-2008019151-A1 | OXETANE COMPOSITION, ASSOCIATED METHOD AND ARTICLE | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-02-14 | — | — | WO | disclosed |
| US-7230055-B2 | Compositions containing oxetane compounds for use in semiconductor packaging | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2007-06-12 | — | — | US | disclosed |
| US-20060025542-A1 | Compositions containing oxetane compounds for use in semiconductor packaging | HENKEL AG & CO. KGAA (DE) | 2006-02-02 | — | — | US | disclosed |
| EP-1621534-A2 | Compositions containing oxetane compounds for use in semiconductor packaging | National Starch and Chemical Investment Holding Corporation (US) | 2006-02-01 | — | — | EP | disclosed |