⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21556370 | 0.65 | — | — | |
| SCHEMBL23481311 | 0.65 | — | — | |
| SCHEMBL8337941 | 0.63 | — | — | |
| SCHEMBL22941797 | 0.62 | GRIN2D (0.30) | — | |
| SCHEMBL4414580 | 0.58 | GRM4 (0.38) | — | |
| SCHEMBL14768973 | 0.58 | GRIN2D (0.54) | — | |
| SCHEMBL10813942 | 0.53 | CHRNA7 (0.31) | — | |
| SCHEMBL1278877 | 0.51 | — | — | |
| SCHEMBL24108341 | 0.51 | — | — | |
| SCHEMBL1019549 | 0.49 | GRIN2D (0.46) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1579272-A4 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS | FUJIFILM ELECTRONIC MATERIALS (US) | 2008-12-17 | — | — | EP | claimed |
| US-7018776-B2 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-03-28 | — | — | US | claimed |
| EP-1579272-A2 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS | Fujifilm Electronic Materials USA, Inc. (US) | 2005-09-28 | — | — | EP | claimed |
| US-20040161711-A1 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | claimed |
| US-20040161619-A1 | Process for producing a heat resistant relief structure | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | claimed |
| WO-2004055592-A2 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | claimed |
| EP-1609024-B1 | PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS (US) | 2015-09-30 | — | — | EP | disclosed |
| EP-1636649-B1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS (US) | 2014-08-13 | — | — | EP | disclosed |
| US-20090111050-A1 | Novel Photosensitive Resin Compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2009-04-30 | — | — | US | disclosed |
| WO-2009052177-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2009-04-23 | — | — | WO | disclosed |
| EP-1579272-A4 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS | FUJIFILM ELECTRONIC MATERIALS (US) | 2008-12-17 | — | — | EP | disclosed |
| US-7407731-B2 | of photosensitive polybenzoxazole (PBO) precursors, a mercapto compound of given formula such as 2-mercaptobenzoxazole to inhibit residue from forming, a photosensitive agent, a photoactive compound and solvent; electronics, relief images | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-05 | — | — | US | disclosed |
| EP-1861749-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | Fujifilm Electronic Materials USA, Inc. (US) | 2007-12-05 | — | — | EP | disclosed |
| US-20040229166-A1 | Novel photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. | 2004-11-18 | — | — | US | disclosed |
| WO-2004081057-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-09-23 | — | — | WO | disclosed |
| WO-2004081663-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-09-23 | — | — | WO | disclosed |
| US-20040161711-A1 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | disclosed |
| US-20040161619-A1 | Process for producing a heat resistant relief structure | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | disclosed |
| WO-2004055592-A2 | STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |
| WO-2004055593-A2 | PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |