Silver

Silver

SCHEMBL3972370

CC(C)(C)CC(C)(C)CC(=O)[O-].[Ag+]

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

folP

The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.37
FFAR3 O14843 1/20 0.31
HDAC3 O15379 1/20 0.31
HDAC1 Q13547 1/20 0.31
HDAC2 Q92769 1/20 0.31
HDAC8 Q9BY41 1/20 0.31
KDM4E B2RXH2 1/20 0.30
FFAR1 O14842 1/20 0.30
CPT2 P23786 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Zinc Ion SCHEMBL245619 0.95 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
SCHEMBL246365 0.95 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Silver SCHEMBL6733904 0.84 CA4 (0.43) CA4FFAR3HDAC3HDAC1HDAC2
SCHEMBL10887183 0.78 CA4 (0.43) CA4FFAR3HDAC3HDAC1HDAC2
SCHEMBL4624370 0.78 CA4 (0.50) CA4FFAR3HDAC3HDAC1HDAC2
Potassium Ion SCHEMBL9819337 0.78 CA4 (0.43) CA4FFAR3HDAC3HDAC1HDAC2
SCHEMBL10887232 0.78 CA4 (0.43) CA4FFAR3HDAC3HDAC1HDAC2
T-Butylacetic Acid SCHEMBL11218671 0.78
SCHEMBL666362 0.78 CA4 (0.43) CA4FFAR3HDAC3HDAC1HDAC2
SCHEMBL6733912 0.78 CA4 (0.43) CA4FFAR3HDAC3HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112913012-B Method for manufacturing electromagnetic interference shielding layer 贺利氏德国有限两合公司 2024-07-26 CN disclosed
US-11848276-B2 Method of manufacturing an electromagnetic interference shielding layer HERAEUS ELECTRONICS GMBH & CO. KG (DE) 2023-12-19 US disclosed
US-20210358861-A1 METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER Heraeus Deutschland GmbH & Co. KG (DE) 2021-11-18 US disclosed
EP-3878009-A1 METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER Heraeus Deutschland GmbH & Co KG (DE) 2021-09-15 EP disclosed
CN-112913012-A Method for manufacturing electromagnetic interference shielding layer 贺利氏德国有限两合公司 2021-06-04 CN disclosed
US-20200260593-A1 METHOD OF FORMING A SOLDER CONNECTION AND CARRIER WITH A COMPONENT FIXED TO THE CARRIER BY A SOLDER CONNECTION FM SIEBDRUCK WERBUNG DESIGN GMBH (DE) 2020-08-13 US disclosed
EP-3648161-A1 METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER Heraeus Deutschland GmbH & Co KG (DE) 2020-05-06 EP disclosed
EP-1880412-B1 METHOD FOR FORMING HIGH-RESOLUTION PATTERN WITH DIRECT WRITING MEANS LG CHEMICAL LTD (KR) 2017-11-29 EP disclosed
CN-101176193-B Method for forming high-resolution pattern with direct writing means LG CHEMICAL LTD 2011-04-13 CN disclosed
WO-2006121298-A9 METHOD FOR FORMING HIGH-RESOLUTION PATTERN WITH DIRECT WRITING MEANS LG CHEMICAL LTD (KR) 2009-06-04 WO disclosed
US-7510951-B2 Method for forming high-resolution pattern with direct writing means LG CHEM, LTD. (KR) 2009-03-31 US disclosed
CN-101176193-A Method for forming high-resolution pattern with direct writing means LG CHEMICAL LTD (KR) 2008-05-07 CN disclosed
EP-1880412-A1 METHOD FOR FORMING HIGH-RESOLUTION PATTERN WITH DIRECT WRITING MEANS LG Chem, Ltd. (KR) 2008-01-23 EP disclosed
US-20060281333-A1 Method for forming high-resolution pattern with direct writing means LG CHEM, LTD. (KR) 2006-12-14 US disclosed
WO-2006121298-A1 METHOD FOR FORMING HIGH-RESOLUTION PATTERN WITH DIRECT WRITING MEANS LG CHEM, LTD. (KR) 2006-11-16 WO disclosed