SCHEMBL400344

SCHEMBL400344

C1CCC[SiH2]CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1226137 1.00
SCHEMBL400244 1.00
SCHEMBL12272287 1.00
SCHEMBL1226953 1.00
Hydrochloric Acid SCHEMBL27779801 0.95
SCHEMBL28295899 0.95
SCHEMBL27576289 0.95
SCHEMBL28218386 0.95
SCHEMBL31243568 0.95
SCHEMBL27949066 0.95

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9343293-B2 Flowable silicon—carbon—oxygen layers for semiconductor processing APPLIED MATERIALS, INC. (US) 2016-05-17 US claimed
US-20140302688-A1 FLOWABLE SILICON-CARBON-OXYGEN LAYERS FOR SEMICONDUCTOR PROCESSING APPLIED MATERIALS, INC. (US) 2014-10-09 US claimed
US-20130217239-A1 FLOWABLE SILICON-AND-CARBON-CONTAINING LAYERS FOR SEMICONDUCTOR PROCESSING APPLIED MATERIALS, INC. (US) 2013-08-22 US claimed
US-20130217240-A1 FLOWABLE SILICON-CARBON-NITROGEN LAYERS FOR SEMICONDUCTOR PROCESSING APPLIED MATERIALS, INC. (US) 2013-08-22 US claimed
WO-2013036667-A2 FLOWABLE SILICON-CARBON-NITROGEN LAYERS FOR SEMICONDUCTOR PROCESSING APPLIED MATERIALS, INC. (US) 2013-03-14 WO claimed
US-8101236-B2 Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-01-24 US claimed
US-20090181178-A1 SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-07-16 US claimed
US-20060165891-A1 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2006-07-27 US claimed
EP-4746858-A2 COATED NANOPARTICLES AND THEIR USE FOR DELIVERY OF THERAPEUTIC AND DIAGNOSTIC AGENTS Politecnico Di Torino (IT) 2026-05-27 EP disclosed
EP-3880756-B1 METALLIC BISMUTH PIGMENTS SUN CHEMICAL CORP (US) 2025-12-24 EP disclosed
US-12486448-B2 Perovskite compound-based electroluminescent layer and light emitting device comprising same INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY (KR) 2025-12-02 US disclosed
US-12378495-B2 Tribotechnical compositions from self-assembled carbon nanoarchitectonics, and applications thereof P & S GLOBAL HOLDINGS LLC (US) 2025-08-05 US disclosed
US-20250215174-A1 Hydrophobic Coatings on Glass Having Superior Properties and Methods of Coating Using Atomic or Molecular Deposition ALD NANOSOLUTIONS, INC. 2025-07-03 US disclosed
WO-2025021705-A2 COATED NANOPARTICLES AND THEIR USE FOR DELIVERY OF THERAPEUTIC AND DIAGNOSTIC AGENTS POLITECNICO DI TORINO (IT) 2025-01-30 WO disclosed
US-7504457-B2 Functionalized polymers and improved tires therefrom BRIDGESTONE CORPORATION (JP) 2009-03-17 US disclosed
US-7479306-B2 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-20 US disclosed
EP-1836238-A1 FUNCTIONALIZED POLYMERS AND IMPROVED TIRES THEREFROM Bridgestone Corporation (JP) 2007-09-26 EP disclosed
US-20060173138-A1 particularly tire treads exhibiting reduced rolling resistance; include a primary or secondary amine group and a silicon-containing or tin-containing group at or near at least one end of a polymer chain BRIDGESTONE CORPORATION (JP) 2006-08-03 US disclosed
US-20060165891-A1 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2006-07-27 US disclosed
WO-2006076629-A1 FUNCTIONALIZED POLYMERS AND IMPROVED TIRES THEREFROM BRIDGESTONE CORPORATION (JP) 2006-07-20 WO disclosed