Known targets — ChEMBL curated mechanism
ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | TSHR | P16473 | 3/20 | 0.42 |
| ▸ | FFAR3 | O14843 | 3/20 | 0.39 |
| ▸ | LCK | P06239 | 1/20 | 0.39 |
| ▸ | FYN | P06241 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.39 |
| ▸ | CES2 | O00748 | 1/20 | 0.38 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.38 |
| ▸ | THRB | P10828 | 2/20 | 0.37 |
| ▸ | BLM | P54132 | 1/20 | 0.36 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.35 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.35 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.35 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acetic Acid SCHEMBL7769091 | 0.97 | ALDH1A1 (0.44) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL262664 | 0.94 | FFAR3 (0.44) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL768587 | 0.90 | ALDH1A1 (0.56) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL28248415 | 0.89 | FFAR3 (0.39) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL28096518 | 0.87 | MEN1 (0.52) | ALDH1A1TSHRFFAR3LCKFYN | |
| Triethylene Glycol SCHEMBL273639 | 0.87 | MEN1 (0.52) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL4208068 | 0.87 | TSHR (0.52) | ALDH1A1TSHRCES2HCAR2THRB | |
| Acetic Acid SCHEMBL356157 | 0.87 | ALDH1A1 (0.38) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL896476 | 0.86 | TSHR (0.44) | ALDH1A1TSHRFFAR3LCKFYN | |
| Acetic Acid SCHEMBL26934034 | 0.84 | TSHR (0.54) | ALDH1A1TSHRFFAR3LCKFYN |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103535120-B | Conductive pattern and manufacture method thereof | DIC株式会社 | 2016-09-07 | — | — | CN | disclosed |
| CN-103201117-B | Resin composition for forming receiving layer, and receiving substrate, printed matter, conductive pattern and circuit obtained using same | DIC CORP. (JP) | 2015-08-19 | — | — | CN | disclosed |
| CN-104588643-A | metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate | DAINIPPON PRINTING CO LTD | 2015-05-06 | — | — | CN | disclosed |
| CN-102596455-B | Metal microparticle dispersion, method for producing conductive substrate, and conductive substrate | DAINIPPON PRINTING CO LTD | 2015-02-04 | — | — | CN | disclosed |
| CN-103535120-A | Conductive pattern and method for producing same | DAINIPPON INK & CHEMICALS | 2014-01-22 | — | — | CN | disclosed |
| CN-103249571-A | Resin composition for forming receiving layer, receiving substrate obtained using same, printed matter, conductive pattern, and electrical circuit | DAINIPPON INK & CHEMICALS | 2013-08-14 | — | — | CN | disclosed |
| CN-103201117-A | Resin composition for forming receiving layer, and receiving substrate, printed matter, conductive pattern and circuit obtained using same | DAINIPPON INK & CHEMICALS | 2013-07-10 | — | — | CN | disclosed |
| CN-103170618-A | Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate | DAINIPPON PRINTING CO LTD | 2013-06-26 | — | — | CN | disclosed |
| CN-102596455-A | Metal microparticle dispersion, method for producing conductive substrate, and conductive substrate | DAINIPPON PRINTING CO LTD | 2012-07-18 | — | — | CN | disclosed |
| US-RE40728-E1 | Acid functional polymers based on benzocyclobutene | DOW GLOBAL TECHNOLOGIES INC. | 2009-06-09 | — | — | US | disclosed |
| EP-1593149-A1 | FLUORINE-FREE PLASMA CURING PROCESS FOR POROUS LOW-K-MATERIALS | Axcelis Technologies, Inc. (US) | 2005-11-09 | — | — | EP | disclosed |
| US-6902771-B2 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2005-06-07 | — | — | US | disclosed |
| US-20050042464-A1 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2005-02-24 | — | — | US | disclosed |
| WO-2004066374-A1 | FLUORINE-FREE PLASMA CURING PROCESS FOR POROUS LOW-K-MATERIALS | AXCELIS TECHNOLOGIES, INC. (US) | 2004-08-05 | — | — | WO | disclosed |
| US-20040028916-A1 | Fluorine-free plasma curing process for porous low-k materials | AXCELIS TECHNOLOGIES, INC. | 2004-02-12 | — | — | US | disclosed |
| US-20030157340-A1 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2003-08-21 | — | — | US | disclosed |
| US-20030104225-A1 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2003-06-05 | — | — | US | disclosed |
| US-6361926-B1 | curable polybenzocylobutane with carboxy group on C6 ring; a photoactive composition comprises a dissolution inhibitor; wet etching; aqueous developable, positive photoresist; toughness, adhesion, dielectric constant, low stress; excellent resolution without the need to handle organic developer solvents | THE DOW CHEMICAL COMPANY | 2002-03-26 | — | — | US | disclosed |
| US-20010018129-A1 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2001-08-30 | — | — | US | disclosed |
| EP-1122770-A2 | Silica-based insulating film and its manufacture | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |