SCHEMBL4024271

SCHEMBL4024271

CCc1ncc(C)n1CCC#N

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 12/20 0.39
ALDH1A1 P00352 9/20 0.39
HSD17B10 Q99714 7/20 0.39
CASP1 P29466 6/20 0.39
CASP7 P55210 5/20 0.39
MAPK1 P28482 2/20 0.39
GLA P06280 1/20 0.39
GAA P10253 1/20 0.39
CLK4 Q9HAZ1 1/20 0.39
CYP2C9 P11712 2/20 0.37
CYP2C19 P33261 2/20 0.37
KDM4E B2RXH2 1/20 0.37
PDE4A P27815 2/20 0.37
PDE4B Q07343 2/20 0.37
PDE4C Q08493 2/20 0.37
PDE4D Q08499 2/20 0.37
CSNK2A1 P68400 1/20 0.36
HPGD P15428 3/20 0.36
TSHR P16473 4/20 0.35
CYP3A4 P08684 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16267963 0.77 ALDH1A1 (0.41) CYP1A2ALDH1A1HSD17B10MAPK1CYP2C9
SCHEMBL329148 0.77 TSHR (0.41) ALDH1A1GAAKDM4EPDE4APDE4B
SCHEMBL13541809 0.75 CYP2C19 (0.33) HSD17B10CASP1MAPK1CYP2C19KDM4E
SCHEMBL16268172 0.74 MAPT (0.44) ALDH1A1MAPK1GAACYP2C19KDM4E
SCHEMBL3867359 0.74 CYP1A2 (0.37) CYP1A2GLAGAACSNK2A1HPGD
SCHEMBL320009 0.69
SCHEMBL31135275 0.68 PDE4A (0.39) CYP1A2ALDH1A1HSD17B10CASP1CASP7
SCHEMBL3420916 0.67 TLR8 (0.39) ALDH1A1KDM4EPDE4APDE4BPDE4C
SCHEMBL9400691 0.67
SCHEMBL28262066 0.66 PDE4A (0.35) CYP1A2ALDH1A1HSD17B10CASP1CASP7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7541075-B2 Sealant material for plastic liquid crystal display cells including one component epoxy resin composition MITSUI CHEMICALS, INC. (JP) 2009-06-02 US disclosed
EP-1246206-B1 Moisture resistant electrically conductive cements and method for the production and using same POLY FLEX CIRCUITS INC (US) 2007-02-28 EP disclosed
US-20050249891-A1 Sealant material for plastic liquid crystal display cells including two-component epoxy resin composition MITSUI CHEMICALS INC. (JP) 2005-11-10 US disclosed
US-6913798-B2 Sealing material for plastic liquid crystal display cells including two-component epoxy resin composition MITSUI CHEMICALS, INC. (JP) 2005-07-05 US disclosed
US-6812065-B1 Anisotropic conductive paste MITSUI CHEMICALS, INC. (JP) 2004-11-02 US disclosed
US-20040075802-A1 Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element MITSUI CHEMICALS, INC. (JP) 2004-04-22 US disclosed
EP-0897938-B1 Epoxy group-containing resin compositions JSR CORP (JP) 2003-12-03 EP disclosed
US-6555187-B1 Mixture of specified physical properties of an epoxy resin, rubber-like polymer fine particles, inorganic filler, curing agent; use in single layer press hot bonding system, high productivity and humidity resistant MITSUI CHEMICALS, INC. (JP) 2003-04-29 US disclosed
EP-1293536-A1 SEALING MATERIAL FOR PLASTIC LIQUID CRYSTAL DISPLAY CELLS Mitsui Chemicals, Inc. (JP) 2003-03-19 EP disclosed
US-20020176046-A1 Sealing material for plastic liquid crystal display cells MITSUI CHEMICALS, INC. (JP) 2002-11-28 US disclosed
EP-0581536-B1 Epoxy group-containing resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1999-06-30 EP disclosed
EP-0897938-A2 Epoxy group-containing resin compositions JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1999-02-24 EP disclosed
EP-0554817-B1 Epoxy resin composition and cured product thereof MITSUBISHI CHEM CORP (JP) 1998-08-19 EP disclosed
US-5530036-A STORAGE STABLE THERMOSETTING RESIN COMPOSITIONS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-06-25 US disclosed
US-5399604-A Thermosetting resin composition comprising /A/ copolymer of unsaturated carboxylic acid or anhydride, unsaturated compound with epoxy group, unsaturated carboxylic acid ester or other vinyl compound, /B/ organic solvent, /C/ silane coupler JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-03-21 US disclosed
US-5322864-A Low viscosity epoxy resin, liquid curing agent, metal powder MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1994-06-21 US disclosed
EP-0581536-A1 Epoxy group-containing resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1994-02-02 EP disclosed
EP-0554817-A1 Epoxy resin composition and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 1993-08-11 EP disclosed
WO-1991007759-A1 MOISTURE RESISTANT ELECTRICALLY CONDUCTIVE CEMENTS AND METHODS FOR MAKING AND USING SAME POLY-FLEX CIRCUITS, INC. (US) 1991-05-30 WO disclosed
EP-0428165-A1 Moisture resistant electrically conductive cements and method for making and using same POLY-FLEX CIRCUITS, INC. (US) 1991-05-22 EP disclosed