SCHEMBL4028599

SCHEMBL4028599

COC(OC)C([SiH3])(OC)c1ccccn1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
AHR P35869 2/20 0.37
CHRM2 P08172 2/20 0.37
GAA P10253 1/20 0.33
BLM P54132 2/20 0.32
CYP2D6 P10635 1/20 0.32
TSHR P16473 1/20 0.32
KDM4E B2RXH2 3/20 0.31
MAPT P10636 1/20 0.31
HTT P42858 1/20 0.31
MDM2 Q00987 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
TP53 P04637 1/20 0.31
LMNA P02545 1/20 0.30
CYP1A2 P05177 1/20 0.30
POLB P06746 1/20 0.30
CCR1 P32246 1/20 0.30
CCR5 P51681 1/20 0.30
CCR8 P51685 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27827268 0.81 SMN1; SMN2 (0.42) SMN1; SMN2L3MBTL1AHRCHRM2GAA
SCHEMBL6973049 0.77 SMN1; SMN2 (0.45) SMN1; SMN2L3MBTL1AHRCHRM2GAA
SCHEMBL3203997 0.74
SCHEMBL329680 0.72 SMN1; SMN2 (0.41) SMN1; SMN2L3MBTL1AHRCHRM2GAA
SCHEMBL3929046 0.72 SMN1; SMN2 (0.38) SMN1; SMN2L3MBTL1AHRCHRM2GAA
SCHEMBL27967623 0.72 MAPK1 (0.37) GAATSHRKDM4ELMNA
SCHEMBL17976467 0.71 SMN1; SMN2 (0.52) SMN1; SMN2L3MBTL1AHRCHRM2GAA
SCHEMBL3150669 0.70 SMN1; SMN2 (0.42) SMN1; SMN2L3MBTL1AHRCHRM2GAA
SCHEMBL12934595 0.70 SMN1; SMN2 (0.50) SMN1; SMN2L3MBTL1AHRCHRM2GAA
Ammonia Solution, Strong SCHEMBL27641252 0.70 SMN1; SMN2 (0.50) SMN1; SMN2L3MBTL1AHRCHRM2GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10759119-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2020-09-01 US disclosed
US-20190054704-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2019-02-21 US disclosed
US-10137637-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2018-11-27 US disclosed
EP-2738229-B1 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORP (JP) 2018-04-18 EP disclosed
EP-2738228-B1 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORP (JP) 2018-01-17 EP disclosed
US-9771489-B2 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORPORATION (JP) 2017-09-26 US disclosed
US-9732204-B2 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORPORATION (JP) 2017-08-15 US disclosed
US-9725611-B2 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORPORATION (JP) 2017-08-08 US disclosed
EP-2738227-B1 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORP (JP) 2015-10-21 EP disclosed
US-20150239175-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2015-08-27 US disclosed
US-20120295076-A1 ULTRAVIOLET RAY CURABLE INK JET COMPOSITION AND PRINTED OBJECT SEIKO EPSON CORPORATION (JP) 2012-11-22 US disclosed
EP-2017369-A1 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates University of Massachusetts (US) 2009-01-21 EP disclosed
US-6992018-B2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates UNIVERSITY OF MASSACHUSETTS (US) 2006-01-31 US disclosed
US-20040229023-A1 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates UNIVERSITY OF MASSACHUSETTS, A MASSACHUSETTS CORPORATION 2004-11-18 US disclosed
US-6773844-B2 HIGH PERFORMANCE WITH A HIGH REACTIVITY KABUSHIKI KAISHA TOSHIBA (JP) 2004-08-10 US disclosed
US-6689700-B1 Chemical fluid deposition method for the formation of metal and metal alloy films on patterned and unpatterned substrates UNIVERSITY OF MASSACHUSETTS 2004-02-10 US disclosed
EP-1234063-A2 CHEMICAL FLUID DEPOSITION FOR THE FORMATION OF METAL AND METAL ALLOY FILMS ON PATTERNED AND UNPATTERNED SUBSTRATES University of Massachusetts (US) 2002-08-28 EP disclosed
WO-2001032951-A9 CHEMICAL FLUID DEPOSITION FOR THE FORMATION OF METAL AND METAL ALLOY FILMS ON PATTERNED AND UNPATTERNED SUBSTRATES UNIV MASSACHUSETTS (US) 2002-05-30 WO disclosed
US-20020061432-A1 Proton conductive film and fuel cell using the same KABUSHIKI KAISHA TOSHIBA (JP) 2002-05-23 US disclosed
WO-2001032951-A2 CHEMICAL FLUID DEPOSITION FOR THE FORMATION OF METAL AND METAL ALLOY FILMS ON PATTERNED AND UNPATTERNED SUBSTRATES UNIVERSITY OF MASSACHUSETTS (US) 2001-05-10 WO disclosed