SCHEMBL4042687

SCHEMBL4042687

C#CC(O)CCC(O)CC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29785220 0.86 USP2 (0.31)
SCHEMBL12910768 0.83 FDPS (0.31)
SCHEMBL11654394 0.81 CYP2D6 (0.31)
SCHEMBL3885660 0.78 TSHR (0.47) TSHR
SCHEMBL29093233 0.78 TSHR (0.47) TSHR
SCHEMBL428320 0.78 TSHR (0.47) TSHR
SCHEMBL619867 0.78 TSHR (0.47) TSHR
SCHEMBL29093054 0.78 TSHR (0.47) TSHR
SCHEMBL235075 0.76
SCHEMBL15283773 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250051493-A1 PRODUCTION METHOD FOR PRODUCING REACTIVE SILICON GROUP-CONTAINING ORGANIC POLYMER AGC Inc. (JP) 2025-02-13 US disclosed
WO-2024141355-A1 ELECTRONIC DEVICE MANUFACTURING AQUEOUS SOLUTION, METHOD FOR MANUFACTURING RESIST PATTERN AND METHOD FOR MANUFACTURING DEVICE MERCK PATENT GMBH (DE) 2024-07-04 WO disclosed
EP-1627259-A4 COMPOSITIONS SUITABLE FOR REMOVING PHOTORESIST, PHOTORESIST BYPRODUCTS AND ETCHING RESIDUE, AND USE THEREOF AIR PROD & CHEM (US) 2009-04-01 EP disclosed
US-20090081592-A1 FOUNTAIN SOLUTION COMPOSITION FOR LITHOGRAPHIC PRINTING AND HEAT-SET OFFSET ROTARY PRINTING PROCESS FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed
EP-1627259-A1 COMPOSITIONS SUITABLE FOR REMOVING PHOTORESIST, PHOTORESIST BYPRODUCTS AND ETCHING RESIDUE, AND USE THEREOF AIR PRODUCTS AND CHEMICALS, INC. (US) 2006-02-22 EP disclosed
WO-2004107056-A1 COMPOSITIONS SUITABLE FOR REMOVING PHOTORESIST, PHOTORESIST BYPRODUCTS AND ETCHING RESIDUE, AND USE THEREOF AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-12-09 WO disclosed