⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28223995 | 0.96 | CA2 (0.43) | — | |
| SCHEMBL47754 | 0.96 | — | — | |
| Phosphoric Acid SCHEMBL2899922 | 0.92 | CA2 (0.40) | — | |
| SCHEMBL9583822 | 0.92 | — | — | |
| SCHEMBL926171 | 0.92 | — | — | |
| Hydrochloric Acid SCHEMBL1501990 | 0.92 | — | — | |
| SCHEMBL10422682 | 0.92 | — | — | |
| Methane SCHEMBL11614623 | 0.92 | — | — | |
| Bromide SCHEMBL11424991 | 0.92 | — | — | |
| SCHEMBL4074454 | 0.92 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111234462-B | Ethylene diamine tetramethylene phosphonate metal salt/epoxy resin compound, preparation method and application thereof | 南京同宁新材料研究院有限公司 | 2022-11-29 | — | — | CN | disclosed |
| CN-109306176-B | Flame-retardant polyamide resin composition and preparation method thereof | 东华大学 | 2020-05-05 | — | — | CN | disclosed |
| EP-1950249-B1 | RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE | ASAHI KASEI CHEMICALS CORP (JP) | 2015-05-06 | — | — | EP | disclosed |
| EP-1950248-B1 | HEAT-RESISTANT RESIN COMPOSITION | ASAHI KASEI CHEMICALS CORP (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-8263697-B2 | Heat-resistant resin composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2012-09-11 | — | — | US | disclosed |
| CN-101309971-B | heat-resistant resin composition | ASAHI KASEI CHEMICALS CORP. (JP) | 2011-12-28 | — | — | CN | disclosed |
| US-20090305016-A1 | Heat-Resistant Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-12-10 | — | — | US | disclosed |
| US-20090029138-A1 | Resin Composition Having Excellent Heat Resistance | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| CN-101309972-A | Resin composition having excellent heat resistance | ASAHI CHEMICAL CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| CN-101309971-A | heat-resistant resin composition | ASAHI CHEMICAL CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| EP-1950249-A1 | RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| EP-1950248-A1 | HEAT-RESISTANT RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |