SCHEMBL4073257

SCHEMBL4073257

CO[Si](C)(CC(C)NCCN)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL753884 0.82
SCHEMBL9867084 0.81 HTT (0.30)
SCHEMBL13223549 0.77
SCHEMBL28160501 0.75
SCHEMBL8903495 0.74 MAOA (0.31)
SCHEMBL28696360 0.73 HTT (0.30)
SCHEMBL332361 0.73 CA12 (0.32)
SCHEMBL2523181 0.72 CA12 (0.39)
Ethylenediamine SCHEMBL27851287 0.72
SCHEMBL9476813 0.71 HTT (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4190837-A1 ORGANIC POLYMER, CURABLE COMPOSITION, AND CURED PRODUCT Kaneka Corporation (JP) 2023-06-07 EP disclosed
US-RE46688-E1 Curable composition KANEKA CORPORATION (JP) 2018-01-30 US disclosed
EP-3239183-A1 MODIFIED CONJUGATED DIENE POLYMER, AND POLYMER COMPOSITION CONTAINING SAID POLYMER Sumitomo Chemical Company, Ltd. (JP) 2017-11-01 EP disclosed
EP-3064612-A1 SURFACE-TREATED METAL PLATE AND METAL PLATE-RESIN COMPOSITE MOLDED ARTICLE Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) (JP) 2016-09-07 EP disclosed
US-7473441-B2 Curable composition and sealing method for ceramic siding boards KANEKA CORPORATION (JP) 2009-01-06 US disclosed
CN-1297621-C Method for producing modified wood materials SUMITOMO FOREST K K (JP) 2007-01-31 CN disclosed
US-20050272835-A1 Curable composition and sealing method for ceramic siding boards KANEKA CORPORATION (JP) 2005-12-08 US disclosed
CN-1439687-A Method for producing modified wood materials SUMITOMO FOREST K K (JP) 2003-09-03 CN disclosed
US-6444775-B1 POLYETHERSILOXANE COPOLYMER KANEKA CORPORATION (JP) 2002-09-03 US disclosed
WO-1998007793-A1 HYBRID INORGANIC-ORGANIC ENVIRONMENTAL RESISTANT PROTECTIVE COMPOSITIONS FMC CORPORATION (US) 1998-02-26 WO disclosed
US-5514475-A POLYCONDENSED FUSED POLYCYCLIC POLYNUCLEAR AROMATIC RESIN, PRINTED CIRCUIT BOARDS, DIELECTRICS SUMITOMO METAL INDUSTRIES, LTD. (JP) 1996-05-07 US disclosed
US-5229438-A Improved wet adhesion, quick curing MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1993-07-20 US disclosed
US-4596755-A Crosslinking amount of photosensitive azide compound, film forming amount of water soluble polymer, silane KABUSHIKI KAISHA TOSHIBA (JP) 1986-06-24 US disclosed
US-4547311-A DISPERSION OF CARBON BLACK IN FLUOROPOLYMER OR POLYURETHANE DAIKIN KOGYO CO., LTD. (JP) 1985-10-15 US disclosed