SCHEMBL408457

SCHEMBL408457

[BaH2].[O].[SrH2].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23051669 0.87
SCHEMBL7878726 0.87
SCHEMBL7477749 0.87
SCHEMBL25411922 0.87
SCHEMBL928925 0.87
SCHEMBL2021982 0.75
Water SCHEMBL408458 0.75
SCHEMBL28209050 0.75
Water SCHEMBL8083667 0.75
SCHEMBL7721917 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040255856-A1 Method and device for depositing a plurality of layers on a substrate AIXTRON AG, A GERMANY CORPORATION (DE) 2004-12-23 US claimed
US-20250318146-A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-10-09 US disclosed
US-12419057-B2 Semiconductor device, integrated circuit and method of manufacturing the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2025-09-16 US disclosed
US-20240389357-A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-11-21 US disclosed
US-20240373650-A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-11-07 US disclosed
US-12133396-B2 Semiconductor device, integrated circuit and method of manufacturing the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2024-10-29 US disclosed
US-12114511-B2 Semiconductor device, integrated circuit and method of manufacturing the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2024-10-08 US disclosed
US-20230065619-A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2023-03-02 US disclosed
US-20230063125-A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2023-03-02 US disclosed
US-20230066392-A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2023-03-02 US disclosed
CN-103681688-A Substrate including oxide thin film transistor, method for fabricating the same, and driving circuit LG DISPLAY CO LTD 2014-03-26 CN disclosed
US-20140070218-A1 DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2014-03-13 US disclosed
US-20140061653-A1 SUBSTRATE INCLUDING OXIDE THIN FILM TRANSISTOR, METHOD FOR FABRICATING THE SAME, AND DRIVING CIRCUIT FOR LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME LG DISPLAY CO., LTD. (KR) 2014-03-06 US disclosed
CN-103426934-A Oxide thin film transistor, method for fabricating tft, array substrate for display device and method for fabricating the same LG DISPLAY CO LTD 2013-12-04 CN disclosed
US-20130313530-A1 OXIDE THIN FILM TRANSISTOR, METHOD FOR FABRICATING TFT, DISPLAY DEVICE HAVING TFT, AND METHOD FOR FABRICATING THE SAME LG DISPLAY CO., LTD. (KR) 2013-11-28 US disclosed
US-20130313546-A1 Oxide Thin Film Transistor, Method for Fabricating TFT, Array Substrate for Display Device and Method for Fabricating the Same LG DISPLAY CO., LTD. (KR) 2013-11-28 US disclosed
US-20130020567-A1 THIN FILM TRANSISTOR HAVING PASSIVATION LAYER COMPRISING METAL AND METHOD FOR FABRICATING THE SAME KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2013-01-24 US disclosed
US-20120298985-A1 THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2012-11-29 US disclosed
US-20120021138-A1 NANOLAYER DEPOSITION PROCESS FOR COMPOSITE FILMS TEGAL CORPORATION (US) 2012-01-26 US disclosed
US-20040255856-A1 Method and device for depositing a plurality of layers on a substrate AIXTRON AG, A GERMANY CORPORATION (DE) 2004-12-23 US disclosed